2016
DOI: 10.1021/acsnano.6b02488
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Layer Control of WSe2 via Selective Surface Layer Oxidation

Abstract: We report Raman and photoluminescence spectra of mono- and few-layer WSe2 and MoSe2 taken before and after exposure to a remote oxygen plasma. For bilayer and trilayer WSe2, we observe an increase in the photoluminescence intensity and a blue shift of the photoluminescence peak positions after oxygen plasma treatment. The photoluminescence spectra of trilayer WSe2 exhibit features of a bilayer after oxygen plasma treatment. Bilayer WSe2 exhibits features of a monolayer, and the photoluminescence of monolayer W… Show more

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Cited by 82 publications
(80 citation statements)
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“…The ionization is responsible for the charge transfer at the WSe 2 /SiC interface, which causes the XPS core-level peak shift. Although a small positive shift of W 4 f peak to the order of ~0.15 eV can be induced by extensive oxidation 37, 38 and there could be oxidation below the detection limit of XPS, the relatively large W 4 f peak shift (~0.6 eV for a fluence of 10 16 protons/cm 2 and ~0.8 eV for a fluence of 10 17 protons/cm 2 ) observed in this work should be mostly attributed to the charge transfer at the WSe 2 interface. Based on SRIM/TRIM simulations, the electronic energy loss within the WSe 2 and SiC at the sample surface is approximately 56 eV/nm and 39 eV/nm, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…The ionization is responsible for the charge transfer at the WSe 2 /SiC interface, which causes the XPS core-level peak shift. Although a small positive shift of W 4 f peak to the order of ~0.15 eV can be induced by extensive oxidation 37, 38 and there could be oxidation below the detection limit of XPS, the relatively large W 4 f peak shift (~0.6 eV for a fluence of 10 16 protons/cm 2 and ~0.8 eV for a fluence of 10 17 protons/cm 2 ) observed in this work should be mostly attributed to the charge transfer at the WSe 2 interface. Based on SRIM/TRIM simulations, the electronic energy loss within the WSe 2 and SiC at the sample surface is approximately 56 eV/nm and 39 eV/nm, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…Plasma cleaning can also be challenging. For example, O 2 plasma is found to oxidize edges/defects on graphene and the top layer of WSe 2 , and is used in etching and p‐type doping of TMDs . H 2 plasma can lift graphene off SiO 2 , and Cl 2 plasma can cause a heavy p‐doping to graphene .…”
Section: Introductionmentioning
confidence: 99%
“…By defect engineering, the bandgap of graphene can be opened to allow switching of graphene-based transistors with a high on/off ratio [13]. The properties of TMDs can also be tailored by introduction of defects; for example, line defects can act as one-dimensional metallic stripes [28]; laser and ion irradiation can be utilized to thin and dope TMDs [29,30]; GBs influence the electroluminescence (EL) behavior of WS 2 [31]; structural defects or active edge sites can be applied in electrocatalysis [32]; and a strong photoluminescence (PL) enhancement of monolayer MoS 2 can be realized through defect engineering and oxygen bonding [33]. Hence, the investigation of defects is a crucial step for 2D materials research.…”
Section: Introductionmentioning
confidence: 99%