Tungsten transition metal dichalcogenides
(W-TMDs) are intriguing
due to their properties and potential for application in next-generation
electronic devices. However, strong Fermi level (EF) pinning
manifests at the metal/W-TMD interfaces, which could tremendously
restrain the carrier injection into the channel. In this work, we
illustrate the origins of EF pinning for Ni and Ag contacts
on W-TMDs by considering interface chemistry, band alignment, impurities,
and imperfections of W-TMDs, contact metal adsorption mechanism, and
the resultant electronic structure. We conclude that the origins of
EF pinning at a covalent contact metal/W-TMD interface,
such as Ni/W-TMDs, can be attributed to defects, impurities, and interface
reaction products. In contrast, for a van der Waals contact metal/TMD
system such as Ag/W-TMDs, the primary factor responsible for EF pinning is the electronic modification of the TMDs resulting
from the defects and impurities with the minor impact of metal-induced
gap states. The potential strategies for carefully engineering the
metal deposition approach are also discussed. This work unveils the
origins of EF pinning at metal/TMD interfaces experimentally
and theoretically and provides guidance on further enhancing and improving
the device performance.