2016 12th International Congress Molded Interconnect Devices (MID) 2016
DOI: 10.1109/icmid.2016.7738939
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LDS manufacturing technology for next generation radio frequency applications

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Cited by 11 publications
(7 citation statements)
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“…Therefore, the cost of the material limits the further expansion of the technology to the automotive and consumer goods sectors. In addition, a high required concentration of metal–organic additives reduces mechanical properties of a moulded part—moreover, metal-based additives in the polymer matrix shield electromagnetic radiation and limit MID application in the gigahertz frequency range [ 9 , 10 ].…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, the cost of the material limits the further expansion of the technology to the automotive and consumer goods sectors. In addition, a high required concentration of metal–organic additives reduces mechanical properties of a moulded part—moreover, metal-based additives in the polymer matrix shield electromagnetic radiation and limit MID application in the gigahertz frequency range [ 9 , 10 ].…”
Section: Introductionmentioning
confidence: 99%
“…One important advantage of the LDS technique is that it makes it possible to obtain thick and robust metallization by chemical electroless deposition. The downside is the high degree of surface roughness, due to the action of the laser beam during activation [16,17]. Metal was deposited using commercial electroless solutions of copper, nickel, then gold.…”
Section: Simulations and Resultsmentioning
confidence: 99%
“…The proposed antenna was fabricated using an LPKF laser direct structuring (LDS) Protolaser 3D System, available within the Tyndall Microsystems Packaging Laboratory [71]. For antenna fabrication, the LDS technology was chosen because of its advantages such as low cost, easy integration to the enclosure structure, and no need for additional flex PCB [72,73]. The fabrication of the proposed antenna prototype using the LDS technology was completed in the following steps: As shown in Figure 10, a π-type matching network between points B and C has been implemented.…”
Section: Antenna Prototype Fabricationmentioning
confidence: 99%