Leading edge die stacking and wire bonding technologies for advanced 3D memory packages

Yauw, Oranna; Wu, Jie; Tan, Andrew; Qin, Ivy; Shah, A.; Yang, Jeong Ho; Schulze, Gary

doi:10.1109/eptc.2017.8277544

Cited by 5 publications

(2 citation statements)

References 3 publications

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“…In the case of excessive current density, EM has a particularly serious impact on the reliability of electronic line connections, and is one of the most intractable problems in high-performance microelectronics components [68,69]. Due to the significant increase in power density and the development of ultra-fine pitch circuits for miniaturization, the problem caused by the EM phenomenon has become more prominent, and the main failures of modules are attributed to wear caused by EM at the wire interconnect [70,71]. Chen et al [72] studied the microstructure evolution and electromigration failure mechanism of Ag alloy bond wire, and found that EM-induced failure of AG-4Pd bonding wire occurred in a phased manner.…”

Section: Reliability Of Silver Wire Bondingmentioning

confidence: 99%

A Review of Silver Wire Bonding Techniques

An,

Zhou,

Cao

et al. 2023

Micromachines

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The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed.

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Section: Reliability Of Silver Wire Bondingmentioning

confidence: 99%

A Review of Silver Wire Bonding Techniques

An,

Zhou,

Cao

et al. 2023

Micromachines

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“…In the packaging process of three-dimensional memory chips, DAF (die attach film) is usually used for the die bond [23], with a typical thickness of 5−30 μm [24]. In this section, the influence of DAF thickness and the coefficient of thermal expansion (CTE) on warpage is investigated.…”

Section: Influence Of Die Bond Materials On Warpagementioning

confidence: 99%

Viscoelastic Simulation of Stress and Warpage for Memory Chip 3D-Stacked Package

et al. 2022

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Three-dimensional-stacked packaging technology is widely used in memory chip packaging, which can greatly increase the utilization ratio of the packaging area. However, problems with the reliability of 3D-stacked packaging are also becoming more and more serious. In this paper, first, a dynamic mechanical analyzer is used to obtain the EMC viscoelasticity parameters. Then, the influence trend of different factors, such as EMC, die bond material and chip, on the performance of the memory chip 3D-stacked packaging under a fixed temperature cyclic loading condition is explored by the FE method.

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