“…Understanding the electrical properties of the oxide-Ga2O3 interfaces under either normal condition or constant voltage stress is important for developing Ga2O3 MOS devices, which impact critical parameters such as threshold voltage, channel mobility, and device stability. Analyses of the interface state density at the interface between β-Ga2O3 and atomic layer deposition (ALD) or Low-Pressure Chemical Vapor Deposition (LPCVD) SiO2 [19,20] , ALD Al2O3 [13,19,21] , and ALD HfO2 [16,22] dielectrics have been reported recently, particularly, there are already many systematical works [13,19,21] about the electrical properties, interface trap, and stress-induced charge trapping of the Al2O3/β-Ga2O3 MOS structures, but only a few work [21] focus on stress-induced reliability of the β-Ga2O3 MOS capacitor. In this work, β-Ga2O3 MOS capacitors (MOSCAP) with ALD-derived HfAlO dielectric were fabricated, and the responses to constant voltage stress (CVS) of HfAlO /Ga2O3 MOS structure were evaluated via capacitance-voltage (C-V) and current-voltage (I-V) methods.…”