Counterfeit electronic components are known to enter supply chains
through recycling, with these already-aged components creating serious
reliability risks, particularly for critical infrastructure systems. A
number of recycled integrated circuit (IC) risk mitigation approaches
have been proposed, but these generally lack pragmatic feasibility. This
work proposes a novel real-world deployable on-board sensor that: 1) is
tamper-resistant by exploiting near-permanent changes caused by hot
carrier injection (HCI); 2) generates a DC signal measurable by common
low-cost test equipment; and 3) reuses an existing I/O interface,
including existing pins; while 4) requiring a very small footprint.
Combining this sensor with a random sample-based testing strategy allows
for low-cost and time efficient detection of fraudulently recycled
batches of ICs. Through simulation-based validation using
process-accurate models of a 65 nm technology we show that employing a
random sample size as small as 60 is sufficient for identifying such
batches with a statistical significance level of 0.01.