Li-insertion/extraction properties of three-dimensional Sn electrode prepared by facile electrodeposition method

Abstract

Toward the realization of reliable Li-ion batteries with high performance and safety, component materials such as those of the current collector and negative electrode require further innovation. Sn, one of the most promising negative-electrode materials, can be electrochemically fixed on a substrate without any binder or conductive additive. However, the pulverization of Snplating films on substrates caused by large volume changes during Li-Sn reactions is the main reason hindering the practical application of Sn-plated electrodes. In the present study, we developed an electrodeposited three-dimensional (3D) Cu substrate applied to underlayer of the electrode. The effect of substrate geometry on the charge-discharge performance of the Sn electrode was investigated. The 3D-Cu/Sn electrode exhibited superior cycling performance with a reversible capacity of 470 mA h g-1 even at the 300th cycle, whereas the Sn-plated electrode prepared on a typical flat Cu substrate showed a capacity of only 20 mA h g-1. The results demonstrated that the 3D structure played a key role in accommodating volumetric changes in the Sn to suppress electrode disintegration. The developed 3D-Cu substrate will be significantly useful as a current collector for alloy-based active materials.

Regulation of Dendrite-Free Li Plating via Lithiophilic Sites on Lithium-Alloy Surface

“…Considerable efforts have been devoted to addressing the issues of Li dendrite formation. There are several effective strategies, including designing Li alloys with more lithiophobic sites and ,− , creating an artificial SEI layer , , and optimizing the electrolyte chemistry. ,− The lithiophilic sites of the substrate materials are of vital importance for the Li plating process. If the substrate surface maintains numerous lithiophilic sites, Li can adsorb stably and grow smoothly across the substrate surface to produce no Li nucleation overpotential at the beginning of Li plating .…”

“…Li diffuses faster in Li alloys, such as Li 13 In 3 , LiZn, Li 3 Bi, and Li 3 As, compared to Li metal, where the Li dendrite formation and growth can be suppressed significantly. − , The fast Li diffusion can avoid tip effect-induced Li nucleation and thus achieve a uniform Li deposition, whereas a slow Li diffusivity and random Li nucleation process cause a large overpotential. A higher Li diffusion could allow a higher probability for Li to deposit in the vicinity of the substrate instead of being reduced directly on a local protuberant site of the substrate. − Furthermore, the 3D scaffold structure can adjust the volume change and increase the Li diffusion, resulting in high capacity and good cycling stability. ,, For example, the innovative 3D Li/Li 22 Sn 5 nanostructure forming a 3D Li 22 Sn 5 interconnected network provides an easy pathway for Li-ion and electron diffusion, which accelerates the Li diffusion and subsequently suppresses the Li dendrite formation and increases the Coulombic efficiency of LMBs.…”

Fabrication of Roughened Electrodeposited Copper Coating on Steel for Dissimilar Joining of Steel and Thermoplastic Resin

“…For practical applications, a joining technology with a roughened plating film that does not rely on composite plating is desirable. We have already reported that a roughened electrodeposited copper film can be fabricated using a roughening agent [19], and that the roughened copper film acts as an effective current collector when applied to a lithium [20,21] or sodium [22] ion battery anode.…”

Design of Roughened Current Collector by Bottom-up Approach Using the Electroplating Technique: Charge–Discharge Performance of a Sn Negative-Electrode for Na-Ion Batteries

“…This is because the major issues upon the use of metal-based negative electrode materials such as peeling off and electrical isolation are common in both the battery systems. In our previous electrodeposition studies, we found that Cu grows in sheet form on a substrate by electroplating in a copper­(II) sulfate (CuSO 4 )-based aqueous solution containing poly­(acrylic acid) (PAA). − The results showed that the PAA molecules acted as a roughening agent in the preparation of a bottom-up type approach. Although an Al substrate can also be used as a current collector in view of the operating voltage of a Sn negative electrode for NIB, it is expected that the application of a roughened-Cu substrate would improve the cycling performance.…”