Life cycle impact assessment of semiconductor packaging technologies with emphasis on ball grid array

Kuo, Chien-Hung; Hu, Allen H.; Hung, Lance Hongwei; Yang, Kuei-Tzu; Wu, Chen-Hua

doi:10.1016/j.jclepro.2020.124301

Cited by 21 publications

(9 citation statements)

References 22 publications

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“…The Covid 19 epidemic caused many industries, such as the automobile industry, to face inventory shortages due to the unavailability of silicon chips (Kuo et al, 2020). It is known from experience that our supply chain is highly unpredictable, so the research area to manage the supply chain and inventory through Industry 4.0 is growing (Chen, 2019), and we can indirectly link TQM and IM.…”

Section: Emphasis On Future Directionsmentioning

confidence: 99%

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Inventory management and TQM practices for better firm performance: a systematic and bibliometric review

Mahajan,

Raut,

Kumar

et al. 2023

TQM

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PurposeThis paper aims to quantify the trend of variables used for building a theoretical model with the help of analysing bibliometrics data of inventory management (IM) and Total Quality Management (TQM) practices and their effects on firm performance.Design/methodology/approachScopus' research database and the Web of Science (WoS) (including Elsevier, Emerald Group Publishing, Taylor and Francis, Wiley, IEEE, Informs and SAGE) were used to find relevant articles. The articles, review papers and conference proceedings were screened from 1993 to 2021. The articles were analysed to explain the different types of IM practices, TQM practices and their effect on the firm's performance. Thematic analysis was done using a bibliometric package of “R” (Biblioshiny) and VOSviewer to identify the key trends, approaches and research agenda.FindingsThe research covered 28 years of publications and summarised 497 articles, review papers and conference papers. Researchers concluded that IM highly correlates with the inventory turnover ratio and has no relation to firm performance. Further, TQM positively affects firm performance, but integrating IM and TQM will be a research scope for future study as none of the researchers previously covered this.Research limitations/implicationsDue to the systematic literature review (SLR) and Bibliometric review, the study is limited to the Scopus and WoS (including Elsevier, Emerald Group Publishing, Taylor and Francis, Wiley, IEEE, Informs and SAGE) databases.Originality/valueBeing the research on a bibliometric and systematic review, relating IM practices with TQM practices would be the novelty of this paper.

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Section: Emphasis On Future Directionsmentioning

confidence: 99%

“…The Covid 19 epidemic caused many industries, such as the automobile industry, to face inventory shortages due to the unavailability of silicon chips (Kuo et al. , 2020).…”

Section: Managerial and Theoretical Implication And Emphasis On Futur...mentioning

confidence: 99%

Inventory management and TQM practices for better firm performance: a systematic and bibliometric review

Mahajan,

Raut,

Kumar

et al. 2023

TQM

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“…The next step, semiconductor packaging and assembly process, involves enclosing ICs and encompasses from die-attach adhesives to liquid and film-shaped encapsulation compounds, sealing, lead forming/trimming, deflash, wirebonding, lead finish to heat-conducting materials, and conductive and non-conductive adhesives for sensors, among others. The encapsulation technology protects the sensitive layers from external influences and maintains their efficiency [59,60]. Finally, the final component is carefully tested in order to verify if it meets the requirements of standard specifications.…”

Section: Semiconductor Manufacturing Processmentioning

confidence: 99%

A Review of Data Mining Applications in Semiconductor Manufacturing

Espadinha-Cruz

Godina

Rodrigues³

2021

Processes

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For decades, industrial companies have been collecting and storing high amounts of data with the aim of better controlling and managing their processes. However, this vast amount of information and hidden knowledge implicit in all of this data could be utilized more efficiently. With the help of data mining techniques unknown relationships can be systematically discovered. The production of semiconductors is a highly complex process, which entails several subprocesses that employ a diverse array of equipment. The size of the semiconductors signifies a high number of units can be produced, which require huge amounts of data in order to be able to control and improve the semiconductor manufacturing process. Therefore, in this paper a structured review is made through a sample of 137 papers of the published articles in the scientific community regarding data mining applications in semiconductor manufacturing. A detailed bibliometric analysis is also made. All data mining applications are classified in function of the application area. The results are then analyzed and conclusions are drawn.

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“…(3) Standard specification: The generic function of specification means that the packaging has standard size, shape, number of pins, pitch, length etc., that can be matched with the printed circuit board (PCB), making it processable for the related production lines and equipment, offering standardisation and convenience for packaging users, board, and semiconductor manufacturers [7,12]. In summary, the packaging not only plays the role of protecting the chip, enhancing thermal conductivity, and reliability, but also acts as a bridge between the internal world of the chip and the external circuit [13,14].…”

Section: Introductionmentioning

confidence: 99%

Polymer‐based nanocomposites in semiconductor packaging

Sun

2023

IET Nanodielectrics

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Semiconductor packaging materials play a critical role in the development of semiconductor devices. They not only provide reliable protection and support, but also contribute to the electrical connection between the chip and the external circuit. Among many choices of packaging materials, polymer‐based nanocomposites have become the mainstream candidate due to their low cost, easy processability, and tunable properties. Materials with low dielectric constant and dielectric loss, high glass transition temperature, fast thermal conductivity, suitable coefficient of thermal expansion, low viscosity, and good processability are commonly required in semiconductor packaging, yet most polymers do not meet these criteria. Therefore, modulation of the polymer matrix, introduction of suitable fillers, and modification of the filler surface are often effective approaches to enhance the performance of the composites. Here, the authors first review current research progresses of polymer‐based nanocomposites for five different types of packaging applications, namely moulding compounds, thermal interface materials, underfills, die attach materials, and substrates. The authors then present prospects of developing next‐generation polymer‐based nanocomposites for advanced semiconductor packaging and propose some suggestions to solve the existing challenges.

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Life cycle impact assessment of semiconductor packaging technologies with emphasis on ball grid array

Cited by 21 publications

References 22 publications

Inventory management and TQM practices for better firm performance: a systematic and bibliometric review

Inventory management and TQM practices for better firm performance: a systematic and bibliometric review

A Review of Data Mining Applications in Semiconductor Manufacturing

Polymer‐based nanocomposites in semiconductor packaging

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