Lifetime modeling and simulation of power modules for hybrid electrical/electrical vehicles

Thoben, M.; Sauerland, F.; Mainka, K.; Edenharter, S.; Beaurenaut, Laurent

doi:10.1016/j.microrel.2014.07.009

Cited by 28 publications

(12 citation statements)

References 5 publications

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“…The parameters determining the overall performance of a power module are thermal impedance (resistance and capacitance), operating and maximum junction temperature (T j op , T jmax ), parasitic resistance and inductance, power cycling, thermal cycling/shock, vibration ruggedness, etc. [2][3][4][5][6][7][8][9][10][11][12][13]. People have made numerous technical advancements to improve these parameters through material and processing development and package structure optimization.…”

Section: Modeling and Simulation For Electric Vehicle Applicationsmentioning

confidence: 99%

“…Figure 11 shows the commercial DLC modules with pin-fin plate. A technology trend for IGBT module cooling in HEV/EV power-train system uses coolant with elevated temperature, so the power device can share cooling system with engine at up to 105°C liquid [3,8]. This will simplify power electronics system without separate cooling circuit, resulting in the reduction of overall cost, weight, and volume of whole vehicle.…”

Section: Direct Liquid-cooled Hev/ev Power Modulementioning

confidence: 99%

“…Therefore, the core component in the power system of HEV/EV is power semiconductor switches, which are normally insulated gate bipolar transistor (IGBT) and free-wheeling diode (FWD) at the moment [2]. For increasing power, reliability, and prolonging lifetime, IGBT and FWD chips are packaged to module with multiple devices, isolation layer, and protection parts [2][3][4][5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles

Wang¹,

Dai²,

Liu³

et al. 2016

Modeling and Simulation for Electric Vehicle Applications

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Power semiconductor modules are the core components in power-train system of hybrid and electric vehicles (HEV/EV). With the global interests and efforts to popularize HEV/EV, automotive module has become one of the fast growing sectors of power semiconductor industry. However, the comprehensive requirements in power, frequency, efficiency, robustness, reliability, weight, volume, and cost of automotive module are stringent than industrial products due to extremely high standards of vehicle safety and harsh environment. The development of automotive power module is facing comprehensive challenges in designing of structure, material, and assembly technology. In this chapter, the status and trend of power semiconductor module packaging for HEV/EV are investigated. Firstly, the functionality of power electronics and module in HEV/EV power-train system, as well as the performance requirements by automotive industry, is addressed. A general overview of HEV/EV module design and manufacturing is discussed. Then, the typical state-of-the-art commercial and custom HEV/EV power modules are reviewed and evaluated. Lastly, the packaging trends of automotive module are investigated. The advanced assembly concept and technology are beneficial to thermal management, minimized parasitic parameters, enhancement of thermal and mechanical reliability, and the reduction of weight, volume, and cost.

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Section: Modeling and Simulation For Electric Vehicle Applicationsmentioning

confidence: 99%

Section: Direct Liquid-cooled Hev/ev Power Modulementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles

Wang¹,

Dai²,

Liu³

et al. 2016

Modeling and Simulation for Electric Vehicle Applications

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“…Power electronics plays a key role in the generation, storage, and distribution cycle of electric energy. Power electronics is especially gaining increasingly more importance in the automotive sector for applications in hybrid electric vehicles and electric vehicles . The higher operation temperatures and the current density increase of new insulated gate bipolar transistor generations has meant that meeting the quality requirements for power electronic packages and modules has become increasingly more complicated .…”

Section: Introductionmentioning

confidence: 99%

“…Power electronics is especially gaining increasingly more importance in the automotive sector for applications in hybrid electric vehicles and electric vehicles. [1] The higher operation temperatures and the current density increase of new insulated gate bipolar transistor generations has meant that meeting the quality requirements for power electronic packages and modules has become increasingly more complicated. [2] The high power will induce large thermomechanical stresses in electronic devices, which poses considerable challenges for the assembly of the devices and packaging materials, in particular the solder joint, which is the main cause of device failure and high thermal resistance.…”

Section: Introductionmentioning

confidence: 99%

Comparative study of Au–Sn and Sn–Ag–Cu as die‐attach materials for power electronics applications

Lee

Yoon

2016

Surface & Interface Analysis

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A comparative study of Sn–3.0Ag–0.5Cu (SAC305) and Au–20Sn solders as die‐attach materials for high‐temperature power electronic applications was performed. The solid‐state interfacial reactions of SAC305 and Au–20Sn solders with a Ni‐plated Si chip and a direct‐bonded‐copper substrate, as well as the growth of interfacial intermetallic compound layers and interfacial stability, were investigated and compared during aging at 150 and 200 °C for up to 2000 h. The SAC305 solder exhibited a higher interfacial intermetallic compound growth rate and a higher consumption rate of the Ni layer than the Au–20Sn solder. The Au–20Sn solder had a superior interfacial stability for high‐temperature power electronic applications. Copyright © 2016 John Wiley & Sons, Ltd.

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