2015
DOI: 10.1063/1.4926596
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Light emission from silicon with tin-containing nanocrystals

Abstract: Tin-containing nanocrystals, embedded in silicon, have been fabricated by growing an epitaxial layer of Si_{1-x-y}Sn_{x}C_{y}, where x = 1.6 % and y = 0.04 %, followed by annealing at various temperatures ranging from 650 to 900 degrees C. The nanocrystal density and average diameters are determined by scanning transmission-electron microscopy to ~ 10^{17} cm^{-3} and ~ 5 nm, respectively. Photoluminescence spectroscopy demonstrates that the light emission is very pronounced for samples annealed at 725 degrees… Show more

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Cited by 8 publications
(25 citation statements)
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“…A detailed description of the sample preparation is given in [6]. In short the Sn-nanocrystal samples were prepared by molecular-beam epitaxy, where a composite layer with ratios of 1.6 % Sn and 0.04 % C where co-deposited with Si.…”
Section: Experimental and Resultsmentioning
confidence: 99%
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“…A detailed description of the sample preparation is given in [6]. In short the Sn-nanocrystal samples were prepared by molecular-beam epitaxy, where a composite layer with ratios of 1.6 % Sn and 0.04 % C where co-deposited with Si.…”
Section: Experimental and Resultsmentioning
confidence: 99%
“…in order to form the nanocrystals. From scanning transmission electron microscopy measurements it is know that annealing in that temperature range results in Sn-nanocrystal formation [6], as exemplified in Fig. 1.…”
Section: Experimental and Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…There are several ways to create QDs, from direct over-growth on template substrates to controlled diffusion and segregation 22,23 . The low solubility of Sn in Ge can be used for QDs formation by simply annealing the GeSn layers, which causes the precipitation of Sn 24 .…”
Section: Resultsmentioning
confidence: 99%
“…While fabrication of Si‐based direct‐gap materials has been the most widely used approach for the realizing the desired on‐chip interconnectivity, fabrication of such materials has faced many challenges. Due to their same number of valence electrons as silicon, group‐IV compound alloys are attracting considerable attention . Among these materials, Si 1− x Sn x alloy is a promising candidate for the realizing on‐chip interconnectivity devices because its expected energy gap (0.75–0.95 eV) is favorable for optical communications due to the lack of absorption of the photons at this energy by the Si substrate .…”
Section: Introductionmentioning
confidence: 99%