“…As discussed in Section 2.1 , during the growth process, high-valence state plasma also acquires kinetic energy from the bias voltage, disrupting the continuous growth of columnar crystals and even re-sputtering loose grains, ensuring coating densification. Therefore, high-flux ionization excited by HiPIMS can surmount the typical low-density and rough microstructure, resulting in a unique morphology attained by low-temperature sputter deposition [ 33 , 40 , 109 , 110 , 111 , 112 , 113 , 114 , 115 ]. In comparison to coatings deposited by DCMS, HiPIMS imparted a higher hardness, lower friction coefficient, and better adhesion, wear resistance, and corrosion resistance to the coating [ 93 ].…”