Liquid Crystalline Polyimide Films with High Intrinsic Thermal Conductivities and Robust Toughness

Ruan, Kunpeng; Guo, Yue; Gu, Junwei

doi:10.1021/acs.macromol.1c00686

Cited by 150 publications

(87 citation statements)

References 56 publications

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“…Moreover, high interfacial thermal resistance between the fillers and polymer matrix results in low thermal conductivity for the prepared composites. In addition, introduction of a large number of thermally conductive fillers is likely to cause poor mechanical and processing properties and higher cost and density, and the enhancement in thermal conductivity is relatively limited [ 22 ].…”

Section: Introductionmentioning

confidence: 99%

Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity

et al. 2021

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The development of lightweight and integration for electronics requires flexible films with high thermal conductivity and electromagnetic interference (EMI) shielding to overcome heat accumulation and electromagnetic radiation pollution. Herein, the hierarchical design and assembly strategy was adopted to fabricate hierarchically multifunctional polyimide composite films, with graphene oxide/expanded graphite (GO/EG) as the top thermally conductive and EMI shielding layer, Fe3O4/polyimide (Fe3O4/PI) as the middle EMI shielding enhancement layer and electrospun PI fibers as the substrate layer for mechanical improvement. PI composite films with 61.0 wt% of GO/EG and 23.8 wt% of Fe3O4/PI exhibits high in-plane thermal conductivity coefficient (95.40 W (m K)−1), excellent EMI shielding effectiveness (34.0 dB), good tensile strength (93.6 MPa) and fast electric-heating response (5 s). The test in the central processing unit verifies PI composite films present broad application prospects in electronics fields.

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Section: Introductionmentioning

confidence: 99%

Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity

et al. 2021

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“…In addition to using stretching or shearing process to enhance the alignment of molecular chains, design specific monomer in polymerization process is another method to enhance the alignment of molecular chains. More specifically, Gu et al [ 82 ] synthesized a high thermally conductive liquid crystalline PI films by optimizing the liquid crystal range to fit the curing temperature, and the molecular chains in PI films showed a perfectly ordered structure which can be maintained after solidification, thus giving the PI film a high intrinsic in-plane k of 2.11 W (mK) −1 .…”

Section: High-performance Thermally Conductive Filmsmentioning

confidence: 99%

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

et al. 2022

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Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

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“…In recent years, there have been many publications on polyimide materials [ 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 ]. In this review, the representative progress, mainly in our laboratory, in advanced polyimide films, will be described, especially focusing on the structure and properties for electronic applications.…”

Section: Introductionmentioning

confidence: 99%

Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties

Yang

et al. 2022

Polymers

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Aromatic polyimides have excellent thermal stability, mechanical strength and toughness, high electric insulating properties, low dielectric constants and dissipation factors, and high radiation and wear resistance, among other properties, and can be processed into a variety of materials, including films, fibers, carbon fiber composites, engineering plastics, foams, porous membranes, coatings, etc. Aromatic polyimide materials have found widespread use in a variety of high-tech domains, including electric insulating, microelectronics and optoelectronics, aerospace and aviation industries, and so on, due to their superior combination characteristics and variable processability. In recent years, there have been many publications on aromatic polyimide materials, including several books available to readers. In this review, the representative progress in aromatic polyimide films for electronic applications, especially in our laboratory, will be described.

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Liquid Crystalline Polyimide Films with High Intrinsic Thermal Conductivities and Robust Toughness

Cited by 150 publications

References 56 publications

Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity

Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties

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