Liquid Metal-Filled Micro Heat Pipes for Thermal Management of Solid-State Devices

Dean, Robert N.; Harris, Daniel K.; Palkar, Ashish; Wonacott, G D

doi:10.1109/tie.2012.2196893

Cited by 22 publications

(3 citation statements)

References 22 publications

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“…Among the various liquid metals, mercury is the most well-known material. 11,12 Unfortunately, the toxicity of mercury poses a challenge for its widespread application. Therefore, Galinstan (GaInSn), an excellent replacement of highly toxic mercury, [13][14][15][16] has been used in various microfluidic electronics applications including antennas, [17][18][19][20][21] energy harvesting, 22 and tunable frequency selective surface (FSS).…”

Section: Introductionmentioning

confidence: 99%

An oxidized liquid metal-based microfluidic platform for tunable electronic device applications

Parmar

Lee

2015

Lab Chip

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Easy movement of oxidized Galinstan in microfluidic channels is a promising way for the wide application of the non-toxic liquid metal. In this paper, two different surface modification techniques (physical and chemical) are reported, which dramatically improve the non-wetting characteristics of oxidized Galinstan in the microfluidic channel. In the physical technique, normal paper textures are transferred to the inner wall of polydimethylsiloxane (PDMS) channels and four types of nanoparticles are then coated on the surface of the wall for further improvement of the non-wetting characteristics. Highest advancing angle of 167° and receding angle of 151° are achieved on the paper-textured PDMS with titanium oxide (TiO2) nanoparticles. In the chemical technique, three types of inorganic acids are employed to generate dual-scale structures on the PDMS surface. The inner wall surface treated with sulfuric acid (H2SO4) shows the highest contact angle of 167° and a low hysteresis of ~14° in the dynamic measurement. Creating, transporting, separating and merging of oxidized Galinstan droplets are successfully demonstrated in the fabricated PDMS microfluidic channels. After optimization of these modification techniques, the potential application of tunable capacitors and electronic filters is realized by using liquid metal-based microfluidic devices.

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Section: Introductionmentioning

confidence: 99%

An oxidized liquid metal-based microfluidic platform for tunable electronic device applications

Parmar

Lee

2015

Lab Chip

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“…The stack cooling of perpendicular parallel plates exposed to natural convection was objectively optimized, and the plate separation was varied from 200 to 100 mm, to increase the fluid rate of the sucked liquide through the plate pile while simultaneously increasing the heat transfer between the wall and ambient fluid [10]. The liquid metals, such as indium, a gallium, tin eutectic and Galinstan are known by their favorable thermophysical properties and their cooling efficiency greater by about 20-30 times than that of water [11].…”

Section: Introductionmentioning

confidence: 99%

New Approaches for Protecting the Computer and Electronic Devices Against Heat Dissipation

Medjahed¹,

Lorenzini²,

Rebhi³

et al. 2021

IJSSE

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This research is based on an experimental investigation of four different types of heatsinks, which was backed up by a simulation analysis. The goal of this study is to determine the relevance of various heatsink forms and sizes, as well as to enhance the best situation. The cooling strength of these heatsinks was next investigated experimentally and then numerically, while adjusting in the same initial conditions, finding in principle that the experimental and numerical results agree, with a contrast ratio of less than 10.24%. As a consequence, we concluded that the coolant D3, which is circular and has a heat resistance of 0.582 K. W-1, is stronger than the D2 compact circular cooler, which has a resistance of 0.590 K. W-1. These two varieties were far superior to the regular D1 heatsink, which first debuted in the early days of computers and had a resistance of 0.595 K. W-1, but the best was the mixed engineering D4 heatsink, which had a heat resistance of 0.50 K. W-1. Changes were also made to the geometry of the best heatsink D4, by varying its heights (28, 23, 19, and 15 mm). The heat resistors were arranged in sequence (0.50, 0.560, 0.568, 0.586 kg/s), and the weights were arranger in order (3.12N, 2.56N, 2.11N and 1.67N).

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“…The thermal properties are especially important in several sectors, such as in the electrical machines manufacturing [1], in microelectromechanical systems [2]- [4], electronics and microelectronics [5] [6]. The knowledge of the thermal properties can also improve the energy efficiency [5], [7]- [9].…”

Section: Introductionmentioning

confidence: 99%

Thermal property measurement using a thermal wave generator

Silva¹,

Adissi

Daniel³

et al. 2014

2014 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Proceedings

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This work presents a new method, and its instrument, to measure the thermal conductivity of materials. It employs two different materials, so it is a differential instrument. In this proposed method a thermal wave is generated on one of the surfaces of a given sample, and the temperature is measured at the other surface. From the relationship between the input and output waves is possible to obtain the thermal conductivity of one material. The equation of heat conduction, which describes the behavior of the system, on the materials was deduced and simulated, allowing to determine the temperature at any point of the materials. Along with the equations, the Network Simulation Method was applied to solve the problem, but with a different approach. The experimental setup uses thermoecletric coolers to control temperature, and T thermocouples to measure the temperature. The materials used to apply the method were both thermal insulating and conductive, and with few millimeters thick. Several experiments were performed in order to validate the method and they indicate the feasibility of the instrument.Nomenclature: α -Thermal diffusivity (m 2 /s) κ -Thermal conductivity (W/(mK)) ρ -Density (kg/m 3 ) C p -Specific heat capacity (J/(kgK)) h -Heat Transfer Coefficient H -Sample thickness (mm) L -Total thickness (mm) β -Material parameter ( iω α ) ω -Angular frequency (rad/s)) κ -thermal conductivity (W/(mK)) R -Both sample and reference radius (mm)

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Liquid Metal-Filled Micro Heat Pipes for Thermal Management of Solid-State Devices

Cited by 22 publications

References 22 publications

An oxidized liquid metal-based microfluidic platform for tunable electronic device applications

An oxidized liquid metal-based microfluidic platform for tunable electronic device applications

New Approaches for Protecting the Computer and Electronic Devices Against Heat Dissipation

Thermal property measurement using a thermal wave generator

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