Compositionally
homogeneous Ga-doped Si0.68Ge0.32 bulk crystals
were grown with two different doping concentrations,
i.e., 1 × 1018 cm–3 (GSG1) and 1
× 1019 cm–3 (GSG2), using a vertical
gradient freezing method. The growth was carried out under a mild
temperature gradient of 0.57 °C/mm using a sandwich structured
sample, i.e., Si(seed)/Ga-doped Ge/Si(feed). The grown crystals were
cut along the growth direction to study the compositional variations,
etch pit densities (EPDs), and thermoelectric characteristics. Electron
backscatter diffraction analysis indicated that the (111) orientation
has a larger area compared with other orientations in the grown crystal.
The electrical resistivity decreased along the growth direction, although
the carrier concentrations and mobility of the crystals were unchanged,
possibly because of the variation in EPDs. Moreover, the electrical
resistivity was found to be large at the high EPD region of the crystal.
The electrical resistivity of all the samples gradually increased
with temperature. The maximum values of Seebeck coefficients in GSG1
and GSG2 samples were 466 μV/K at 818 K and 459 μV/K at
892 K, respectively. The calculated power factors of GSG1 and GSG2
were higher than previously reported values (1416 μW m–1 K–2) for Si0.81Ge0.19.