Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish

Luo, Wei‐Chen; Kao, C. R.

doi:10.1109/emap.2002.1188860

Cited by 4 publications

(1 citation statement)

References 2 publications

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“…But Pb is prohibited in the electronic production because of its deleterious effect on the environment and human health. In order to replace Sn-Pb solder, Sn-Ag-Cu system solders were considered as one of prominent lead-free alloys systems because its microstructure is denser and IMC growth speed is lower than that of Sn-Zn, Sn-Cu and Sn-Ag systems [1][2][3][4]. At present, a number of papers have researched the microstructure and IMC growth at both Sn-Ag-Cu/Cu and Sn-Ag-Cu/Ni interface during isothermal aging and thermal cycling aging [5,6].…”

Section: Introductionmentioning

confidence: 99%

Microstructures Transformation in Sn-Base Solders under the Isothermal and Thermal-Shearing Cycling Condition

Huang

et al. 2006

2006 7th International Conference on Electronic Packaging Technology

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The diffusion of the atoms and growth behavior of intermetallic compounds (IMCs) at Sn-3.5Ag-0.5Cu/Cu interfaces under the isothermal aging and thermal-shearing cycling condition were investigated. The results show that there is a Cu6Sn5 IMC layer formed at Sn-Ag-Cu/Cu interface, and the morphology of the Cu6Sn5 changes from scallop-type microstructure to planar-type one with the thermal-shearing cycling increasing, while there are two kinds of IMC, Cu6Sn5 and Cu3Sn, formed at the Sn-Ag-Cu/Cu interfaces after isothermal aging 100 hours. The IMCs growth follows parabola growth kinetics, implying that the IMC growth is controlled by Cu atoms' diffusion. In Sn-Ag-Cu solder, Ag3Sn, forming uniform particles after reflowing, congregates gradually to grow up to chunk-like.

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Section: Introductionmentioning

confidence: 99%

Microstructures Transformation in Sn-Base Solders under the Isothermal and Thermal-Shearing Cycling Condition

Huang

et al. 2006

2006 7th International Conference on Electronic Packaging Technology

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Growth Behavior of IMCs and Fracture Forming Mechanism at Sn-Ag-Cu/Cu Interfaces under Thermal-Shearing Cycling Condition

Liu

Huang²,

et al. 2006

2006 7th International Conference on Electronic Packaging Technology

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Effect of Thermal-Shearing Induced Microstructural Coarsening on SnAgCu Microelectronic Solder

Huang

Zhao

et al. 2007

2007 8th International Conference on Electronic Packaging Technology

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Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish

Cited by 4 publications

References 2 publications

Microstructures Transformation in Sn-Base Solders under the Isothermal and Thermal-Shearing Cycling Condition

Microstructures Transformation in Sn-Base Solders under the Isothermal and Thermal-Shearing Cycling Condition

Growth Behavior of IMCs and Fracture Forming Mechanism at Sn-Ag-Cu/Cu Interfaces under Thermal-Shearing Cycling Condition

Effect of Thermal-Shearing Induced Microstructural Coarsening on SnAgCu Microelectronic Solder

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