Liquid-state and solid-state interfacial reactions of fluxless-bonded Au–20Sn/ENIG solder joint

Yoon, Jeong‐Won; Chun, Hyun-Suk; Jung, Seung‐Boo

doi:10.1016/j.jallcom.2008.01.077

Cited by 35 publications

(9 citation statements)

References 36 publications

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“…Nevertheless, under the drive of environmentally friendly manufacturing, much requirement has been attached to lead-free solder alloys, among which Aubased solder alloy is seen as an excellent filler metal to replace the Pb-based solder alloy used in high-temperature conditions [13,14]. Au-Sn [15], Au-Si [16], Au-Ge [17], Au-Sb [18], and other Au-based low-temperature solders with a melting temperature lower than 400 °C have become the ideal substitute for solder alloys containing high content of lead due to their good wettability, excellent brazing performance, high joint strength, good thermal fatigue resistance, high thermal conductivity, and small dissolution for gold-plated pads [19,20]. In recent years, to meet the temperature requirement of high integrated electronic devices, Aubased medium-temperature solder alloys with the melting temperature of 400-600 °C have received more and more attention, the majority of which are Au-Ag, Au-In, and Au-Ga solder alloys [13,21].…”

Section: Introductionmentioning

confidence: 99%

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity. Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently. But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared.

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Section: Introductionmentioning

confidence: 99%

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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“…Eutectic Au-20 wt.% Sn solder (denoted as Au20Sn hereafter) is one of the commonly used solders in optoelectronic packaging [4][5][6][7]. This solder alloy has excellent fatigue and creep resistances and, in particular, can be applied through a fluxless bonding process [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Microstructural evolution of the Au–20wt.% Sn solder on the Cu substrate during reflow

Chung

Chen

Lin

et al. 2009

Journal of Alloys and Compounds

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“…According to Figure 7, the composition of the lamellar compound was 85.32 at.% Au-9.41 at.% Sn-2.44 at.% Ni-2.09 at.% Cu. The ratio of the atomic percentage of (Au1Ni1Cu) to that of Sn was (89.9):(9.4), which is very close to 10:1, suggesting that the IMC was the b -(Au,Ni,Cu) 10 Sn according to the Au-Sn binary phase diagram shown in Figure 8 (Wei et al, 2011) and Table I structure (Wei et al, 2011;Wei et al, 2013;Yoon et al, 2009Yoon et al, , 2007aYoon et al, , 2007b. As the Ni and Cu atoms have similar properties, it is easy to form quaternary Au-Ni-Cu-Sn compound.…”

Section: Resultsmentioning

confidence: 67%

Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging

Han

Sun

et al. 2019

SSMT

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Purpose The purpose of this paper is to investigate the morphology evolution and the composition transformation of Au-Sn intermetallic compounds (IMCs) of the new Au/Sn-5Sb-1Cu-0.1Ni-0.1Ag/(Au)Ni solder joint during the high temperature aging. Design/methodology/approach Sn-5Sb-1Cu-0.1Ni-0.1Ag solder balls (500 µm in diameter), heat sink with structure of 7.4 µm Au layer on 5 µm Ni-plated Cu alloy and Si chip with 5.16 µm plated Au were used to fabricate micro-solder joints. The joints were performed in a furnace at 150°C for 150, 250 and 350 h aging. The samples were polished and deep etched before analyzed by metallographic microscope and scanning electron microscopy, respectively. Energy dispersive x-ray spectroscopy was used to identify the composition of the IMCs. Findings ß-(Au,Ni,Cu)10Sn phase is formed during the soldering process. The IMCs evolution has two periods during the aging. The first is the ξ-(Au,Ni,Cu)5Sn, ξ-(Au,Cu)5Sn and δ-AuSn were formed and grew to form a full-compound joint after about 150 h aging. The second is the conversion of the full-compound joint. The IMCs converted to ξ′ phase when the aging time extends to 250 h, and transformed to ε-(Au,Ni,Cu)Sn2 and η-(Au,Ni,Cu)Sn4 after 350 h aging. The thicker gold layer and thinner solder joint can promote the growth of the IMCs. ß-(Au,Ni,Cu)10Sn emerged in Au/SnSb-CuNiAg/(Au)Ni in this research, which is not usually found. Originality/value The results in this study have a significant meaning for the application of the new Sn-5Sb-1Cu-0.1Ni-0.1Ag in harsh conditions.

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Liquid-state and solid-state interfacial reactions of fluxless-bonded Au–20Sn/ENIG solder joint

Cited by 35 publications

References 36 publications

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Microstructural evolution of the Au–20wt.% Sn solder on the Cu substrate during reflow

Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging

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