Microstructural evolution of the Au–20wt.% Sn solder on the Cu substrate during reflow

Chung, Hsang-mou; Chen, Chih‐Ming; Lin, Chern‐Sheng; Chen, Chia-ju

doi:10.1016/j.jallcom.2009.06.018

Cited by 39 publications

(17 citation statements)

References 15 publications

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“…4b). These phenomena were also found in the reflow joint of the AuSn20 solder [6] and other eutectic [14] or hypereutectic alloys [20]. For quantitative description, the measured characteristic sizes of the primary phases for the four solidification pathways are presented in Fig.…”

Section: Primary Phases For Different Solidification Pathwaysmentioning

confidence: 77%

“…Many studies of the AuSn20 solder are focusing on the soldering process, the microstructure evolution in the soldering joints [6,7], and the solder alloy's performance [8][9][10]. Considering the manufacturing of this alloy, some unsolved problems still remain, such as the microstructure evolution in the processing and the mechanical behavior of the bulk AuSn20 solder alloy.…”

Section: Introductionmentioning

confidence: 99%

“…They lead to difficulties in the manufacture of the AuSn20 solder strips or foils. In practice, the nonequilibrium solidification usually results in forming primary dendritic ζ-Au 5 Sn phase [6,10]. The length scale and morphology of the dendrites are very critical to the mechanical properties of the alloy, which are always adverse to the manufacturing process.…”

Section: Introductionmentioning

confidence: 99%

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Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20 alloys prepared by different solidification pathways

et al. 2011

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The as-cast AuSn20 eutectic alloys prepared by four different solidification pathways have been investigated in terms of the microstructure and the high-temperature compressive behaviors. The primary phases appeared in the four alloys are very sensitive to the cooling rate, which decrease in the size and the volume fraction as the cooling rate increases. The morphologies of the primary ζ′-Au 5 Sn phase are in dendritic at low cooling rate and change to rosette-like at high cooling rate. When the cooling rate is about 3.5× 10 4 K/min, the primary ζ′-Au 5 Sn can be suppressed but small δ-AuSn particles appear instead as the primary phase. The compressive behaviors at 220°C exhibit a low yielding stress and a long stress platform for the alloy prepared by injection casting with a copper crucible, which indicates an advantageous processing route for the production of the AuSn20 strips or foils.

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Section: Primary Phases For Different Solidification Pathwaysmentioning

confidence: 77%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20 alloys prepared by different solidification pathways

et al. 2011

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“…Apart from former strengths, conservation gold plating from corrosion and avoidance the contamination on optical surface are crucial and consequently keep the cleanliness of the chip in application (Chidambaram et al, 2010a(Chidambaram et al, , 2010bZhang et al, 2009;Chung et al, 2009).…”

Section: Au-20sn Soldermentioning

confidence: 99%

Research and prospect of binary high-temperature Pb-free solders

Huang

et al. 2015

Soldering &Amp; Surface Mount Technology

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2015),"Effect of Au-Sn IMCs' formation and morphologies on shear properties of laser reflowed micro-solder joints", Soldering & Surface Mount Technology, Vol. 27 Iss 1 pp. 45-51 http:// dx.If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -This paper aims to identify a variety of binary system solders by alloying, and relevantly derive multiple system Pb-free solders from the former, attempting to replace the high temperature Sn-Pb solder. Design/methodology/approach -The basis of the paper is the synthesis of previous studies. In terms of some binary high temperature solder alloys, such as Au-20Sn, Bi-2.5Ag, Sn-5Sb, Au-12.5Ge, Zn-6Al and Zn-Sn, taking the alloy phase diagram as the starting point, the melting characteristics, microstructure, mechanical properties, wetting ability and reliability of solder joint are analysed and the prospect is consequently indicated. Findings -Based on the analysis of the six groups of Pb-free solders, the present binary system solder alloys, from the perspective of melting properties, mechanical properties, soldering or reliability of solder joint, rarely meet the comprehensive requirements of replacing the high-temperature Sn-Pb solder. It is assumed to be a solution that multiple-system Pb-free solders derive from a variety of binary system solders by means of alloying. The future development of high temperature Pb-free solder may focus on some factors such as physical properties, mechanical properties, processing, reliability of solder joint, environmental performance and expense. Originality/value -The paper concentrates on the issue of Pb-free solders at high temperature. From a specific perspective of binary system solders, the presently available Pb-free solders are suggested from the starting point of the alloy phase diagram and the prospect of alternatives of Sn-Pb solders at high temperature are indicated.Changhua Du one of the well-known experts in the field of Micro Electronic Connection and Welding Technology, and he is a Professor in School of Materials Science and Engineering, Chongqing University of Technology. With rich experience of working in enterprise and university, he has worked in the area for a long time, taken charge of some projects for the government ...

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“…In particular, Aubased alloys have excellent creep resistance and ideal for in ux-less soldering processes. However, the high cost associated with Au-based alloys limits their wide application [7][8][9] . On the other hand, Zn-based alloys are considered to be cheaper than Au-based alloys, but are limited by their high corrosiveness 10,11) .…”

Section: Introductionmentioning

confidence: 99%

Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder

et al. 2016

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Tensile properties of three Bi-based lead-free solder which are pure Bi, Bi-1.0Ag-0.3Sn-0.03Ge (mass%), and Bi-2.5Ag (mass%) were investigated and compared with that of Pb-rich Pb-2.5Ag-2.5Sn (mass%) solder. Tensile strength of pure Bi is the minimum among solder investigated regardless of the temperature and strain state. Although tensile strength of Bi-based solder is lower than that of Pb-2.5Ag-2.5Sn at 25 C, those of Bi-1.0Ag-0.3Sn-0.03Ge and Bi-2.5Ag improve and become analogous and higher than that of Pb-2.5Ag-2.5Sn at a temperature of 125 C or more. The effect of strain rate on elongation is negligible in solder investigated. Although elongations of Bi-based lead-free solder are lower than that of Pb-2.5Ag-2.5Sn at 25 C, they increase with increasing temperature. While the elongation of Pb-2.5Ag-2.5Sn relatively stable at approximately 20-30% regardless of temperature, elongations of Bi-1.0Ag-0.3Sn-0.03Ge and Bi-2.5Ag become a same level with that of Pb-2.5Ag-2.5Sn at 125 C and 175 C. In particular, the ductility of pure Bi which is about 5% improves drastically at temperatures of 75 C or more and the elongation rises to approximately 60%. From microstructure observation results, it was con rmed that the addition of small amount of Sn and Ge is effective to form ne microstructure. From fracture surface observation results, it was con rmed that brittle fracture occurs at 25 C and the fracture mode changes to ductile fracture when the temperature increases and the ductility improves.

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Microstructural evolution of the Au–20wt.% Sn solder on the Cu substrate during reflow

Cited by 39 publications

References 15 publications

Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20 alloys prepared by different solidification pathways

Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20 alloys prepared by different solidification pathways

Research and prospect of binary high-temperature Pb-free solders

Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder

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