Lithography

Lucas, Kevin; Postnikov, Sergei V.; Henderson, Cliff; Hector, Scott Daniel

doi:10.1016/b978-044451494-3/50003-2

Nano and Giga Challenges in Microelectronics 2003

DOI: 10.1016/b978-044451494-3/50003-2

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Lithography

Kevin Lucas

Sergei V. Postnikov

Cliff Henderson

et al.

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Cited by 2 publications

References 168 publications

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Recent Advances in Lithography and High Level Critical Dimension Metrology Needs for Lithography

Hector¹

2005

AIP Conference Proceedings

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The status and future of imaging metrology needs for lithography AIP Conf. Proc. 550, 339 (2001); 10.1063/1.1354422Metrology needs for the semiconductor industry over the next decade AIP Conf.Abstract. To enable patterning of 65-nm half pitch and smaller dimensions, optical projection lithography is being extended with 193-nm wavelength using water immersion lenses. To enable this extension more complex masks and greater comprehension of variations in the lithography process are being integrated into the integrated circuit design process. Metrology will play a critical role in defining these lithography friendly design rules and practices. The effects of line edge and line width roughness are also becoming increasingly apparent in device performance, so metrology tools need to be modified to accurately measure these variations as well. Tools for measuring critical dimensions, including roughness, with high precision and for quantifying pattern fidelity will be critical to enable the extension of lithography to smaller dimensions.

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Recent Advances in Lithography and High Level Critical Dimension Metrology Needs for Lithography

Hector¹

2005

AIP Conference Proceedings

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Design of an aerostatic imprint head with off-plane alignment functionality for nanoimprint lithography

Chen

et al. 2012

2012 IEEE International Conference on Robotics and Biomimetics (ROBIO)

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Ultra-precision off-plane alignment between the template and the substrate is of great importance to guarantee the quality of patterns manufactured by nanoimprint lithography technology. In this paper, an aerostatic imprint head with off-plane alignment functionality for nanoimprint lithography is developed. The high light of the mechanical design is that the imprint force is transmitted by a spherical aerostatic bearing to the high stiffness frame, thus, bypassing the compliant mechanism, which is employed for high precision off-plane adjustments. This makes the developed device suitable for high load applications while maintaining high alignment precision. The load capacity and stiffness of the imprint device, which are mostly determined by the aerostatic bearing, are studied based on theoretical analysis and experiments. To further increase the stiffness of the device, adjustable magnetic preload is employed. An experiment is performed to study the mechanical characteristics of the imprint head incorporating the magnetic preload structure.

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Lithography

Cited by 2 publications

References 168 publications

Recent Advances in Lithography and High Level Critical Dimension Metrology Needs for Lithography

Recent Advances in Lithography and High Level Critical Dimension Metrology Needs for Lithography

Design of an aerostatic imprint head with off-plane alignment functionality for nanoimprint lithography

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