2007
DOI: 10.1063/1.2719607
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Lithography-free fabrication of graphene devices

Abstract: We have developed a lithography-free, all-dry process for fabricating graphene devices using an ultrathin quartz filament as a shadow mask to avoid possible contamination of graphene during lithographic process. This technique was used to prepare devices for electrical transport as well as planar tunnel junction studies of n-layer graphene (nLG), with n = 1, 2, 3 and higher. We observed localization behavior and an apparent reduction of density of states (DOS) near the Fermi energy in nLG.There has been a flur… Show more

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Cited by 58 publications
(42 citation statements)
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“…Previous studies were mostly aimed at optimizing the morphology of deposited metal structures by controlling the clogging of apertures and deformation in stencil membranes [28,29]. A few attempts of graphene device interconnects involving metal electrodes evaporation through stencil lithography have been reported on pre-patterned exfoliated graphene strips [30] or flakes of suitable size and shape [31]. To our knowledge, multi-step stencil mask usage that includes the graphene etching process steps to pattern complex devices, are not documented to date.…”
Section: Introductionmentioning
confidence: 99%
“…Previous studies were mostly aimed at optimizing the morphology of deposited metal structures by controlling the clogging of apertures and deformation in stencil membranes [28,29]. A few attempts of graphene device interconnects involving metal electrodes evaporation through stencil lithography have been reported on pre-patterned exfoliated graphene strips [30] or flakes of suitable size and shape [31]. To our knowledge, multi-step stencil mask usage that includes the graphene etching process steps to pattern complex devices, are not documented to date.…”
Section: Introductionmentioning
confidence: 99%
“…The role of adsorbates is especially highlighted in the current annealing treatment of suspended graphene. 10,11 In the literature, various approaches, including resist-free processing, 16,29,30 UHV baking, 13,16 and current annealing, 31 have been used to remove contaminants on top of graphene without significant improvement to mobility. These observations collectively suggest that adsorbates on top of graphene cannot be the major culprit in limiting mobility at the current level.…”
mentioning
confidence: 99%
“…Nanodevices [119,120] are the most perspective present and future application area for graphenes. Thus, graphenes can be potentially used in digital memory devices [121] or as building blocks for novel optoelectronic devices [122].…”
Section: Graphenementioning
confidence: 99%