Localization of electrical-insulation and partial-discharge failures of IGBT modules

Mitic, G.; Lefranc, G.

doi:10.1109/28.980373

Cited by 75 publications

(52 citation statements)

References 7 publications

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“…Some researchers have investigated the use of semi-conductive coatings in this area to relieve the dielectric stress [9]. In other work, the same authors reinforce the belief that partial discharges from metalized edges of substrates and silicone gel interfaces are the main sources of partial discharge in a power module [10]. Electrical field simulation results show that maximum field is around the edge of the substrate metallization and this has been verified by optical detection [8].…”

Section: Introductionmentioning

confidence: 66%

Partial discharge control in a power electronic module using high permittivity non-linear dielectrics

Wang

Cotton

Robertson³

et al. 2010

IEEE Trans. Dielect. Electr. Insul.

107

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High electric fields at the edge of the substrate metallization can give rise to partial discharge within power electronic modules and can lead to eventual failure. This paper examines the use of silicone gels filled with barium titanate to reduce the electric field enhancement at the edge of substrate metallization and therefore increase partial discharge inception voltages. The barium titanate filled gel produces a dielectric in which the relative permittivity is increased over a plain gel and that also exhibits a dependence on electric field. The theoretical electric field reduction that can be achieved in a power electronic module through the use of filled gels is demonstrated and compared against experimental measurements including the trial of the technique in some commercial modules. As promising results are achieved, consideration is also given to the effect of the barium titanate filler on the viscosity of the gel and the thermal conductivity, two key manufacturing issues.

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Section: Introductionmentioning

confidence: 66%

Partial discharge control in a power electronic module using high permittivity non-linear dielectrics

Wang

Cotton

Robertson³

et al. 2010

IEEE Trans. Dielect. Electr. Insul.

107

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show abstract

“…The result is a higher stress on the IGBT insulating system. Simulations and analysis reported in the literature [11,12], highlight the presence of significant electric field enhancements corresponding to spots on the metallization edges, which can activate PD. In these conditions, the PD can easily create an irreversible degradation of the insulating material, namely an electrical tree, which brings the dielectric to breakdown.…”

Section: Introductionmentioning

confidence: 95%

Analysis of electrical tree inception in silicone gels

Mancinelli

Cavallini

Dodd

et al. 2017

IEEE Trans. Dielect. Electr. Insul.

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This work assesses the initial and crucial part of electrical treeing degradation, the inception stage, focusing on its dependence on applied voltage waveform and frequency. Tests have been performed on needle-plane configuration samples in solids and gels. A physical model has been formulated through an adaptation of an established theory for solids in which electrical tree inception is related to damage-producing injection currents. The voltage rise time appeared to be the most important parameter influencing the tree inception in the gel, while in the solid material the frequency is more relevant. The analysis leads to the conclusion that tree inception in gels is due to a single highenergy event, in contrast to what is commonly known for solids where damage accumulation takes place. A tree inception model is proposed for the gel, in which initiation is driven by a pressure wave generated by the electric field and the space charge injected into the sample. The model fits the experimental data and may be used to predict the tree initiation for different waveforms and voltage values.

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“…2, conventional modules are encapsulated with a dielectric gel commonly composed of silicone [57][58][59][60][61][62][63]. The principal purpose of this gel is to improve the breakdown strength of the package by preventing arcing between the die surface, wire bonds, and adjacent metal features.…”

Section: Encapsulationmentioning

confidence: 99%

High-Temperature High-Power Packaging Techniques for HEV Traction Applications

Barlow¹,

Elshabini²

2006

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Localization of electrical-insulation and partial-discharge failures of IGBT modules

Cited by 75 publications

References 7 publications

Partial discharge control in a power electronic module using high permittivity non-linear dielectrics

Partial discharge control in a power electronic module using high permittivity non-linear dielectrics

Analysis of electrical tree inception in silicone gels

High-Temperature High-Power Packaging Techniques for HEV Traction Applications

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