Localized corrosion effects and modifications of acidic and alkaline slurries on copper chemical mechanical polishing

Tsai, Tzu-Hsuan; Yen, Shi‐Chern

doi:10.1016/s0169-4332(02)01224-2

Cited by 52 publications

(36 citation statements)

References 12 publications

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“…1, 2). There is strong evidence that the corrosion rate of copper in the presence of BTAH is negligibly small compared to that in its absence [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16]. Had BTAH merely stopped the corrosion reaction, one would have observed a constant mass and constant frequency after addition of BTAH.…”

Section: Injection Of Btahmentioning

confidence: 99%

“…Benzotriazole (C 6 H 5 N 3 , BTAH) has been extensively studied as an inhibitor for the corrosion of copper and many of its alloys [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16], for dezincification of brass [17,18] and as additive in the etching [19], electrodeposition [20][21][22] and in the chemical mechanical polishing of copper [23][24][25]. It has also been reported to inhibit the corrosion of iron [26][27][28], cobalt [29], zinc [30], and nickel [28] and to enhance the resistance of tin bronze to oxidation in air [31].…”

Section: Introductionmentioning

confidence: 99%

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A quartz crystal microbalance study of the kinetics of interaction of benzotriazole with copper

2007

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The kinetics of interaction of benzotriazole (C 6 H 5 N 3 , BTAH) with the surface of copper in salt water were studied using an electrochemical quartz crystal microbalance and X-ray photoelectron spectroscopy (XPS). Upon injecting BTAH into the electrolyte, three regions appear in the time response of the microbalance. Region I (at short time of few minutes), exhibits rapid linear growth of mass with time, which is attributed to the formation of a protective Cu(I)BTA complex. Region II reveals attachment of BTAH at a slower rate onto the inner Cu(I)BTA complex. Region III is a plateau indicating that the BTAH film attains an equilibrium mass and thickness, which increase with the concentration of BTAH. The intensity of the N1s peak in the XPS spectra increases with the time of immersion, indicating more BTAH on the surface. The results suggest a duplex inhibitor film composed of an inner thin layer of Cu(I)BTA and an outer layer of physically adsorbed BTAH which increases in thickness with time and BTAH concentration. They also offer an explanation for the much documented findings of simultaneous increase of the polarization resistance and decrease of double layer capacity with inhibitor concentration and time of immersion.

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Section: Injection Of Btahmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A quartz crystal microbalance study of the kinetics of interaction of benzotriazole with copper

2007

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“…The low etch rate is due to the oxidation of copper by dissolved oxygen and the subsequent complexation of the cuprous ions by ammonia. Tsai et al [13] proposed a detailed mechanism for the dissolution of copper in ammonium hydroxide in presence of dissolved oxygen. In alkaline medium, copper surface would be covered with copper oxides and hydroxides.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical characterization of Cu dissolution and chemical mechanical polishing in ammonium hydroxide–hydrogen peroxide based slurries

Venkatesh

Ramanathan

2009

J Appl Electrochem

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Chemical mechanical polishing (CMP) of copper in ammonium hydroxide based slurry in the presence of hydrogen peroxide was investigated. The polishing trend was found to be similar to that exhibited by other slurries containing hydrogen peroxide and various complexing agents used for Cu CMP. When the hydrogen peroxide concentration is increased, the polish rate increases, reaches a maximum and then decreases. The location and the magnitude of the maximum depend on the ammonium hydroxide concentration. The dissolution of copper in the NH 4 OHhydrogen peroxide solution was probed by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) experiments. Electrical equivalent circuit (EEC) and reaction mechanism analysis (RMA) were employed to determine the mechanistic reaction pathway of Cu dissolution in NH 4 OH-hydrogen peroxide system. Based on the RMA analysis, a four step catalytic mechanism with two adsorbed intermediate species is proposed.

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“…Benzotriazole (C 6 H 5 N 3 , BTAH) has been extensively studied as an inhibitor for the corrosion of copper and many of its alloys [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16], for dezincification of brass [17,18], and as an additive in the etching [19], electrodeposition [20][21][22], and in the chemical mechanical polishing of copper [23][24][25]. It has also been reported to inhibit the corrosion of iron [26][27][28], cobalt [29], zinc [30], and nickel [28] and to enhance the resistance of tin bronze to oxidation in air up to 500 8C [31].…”

Section: Introductionmentioning

confidence: 99%

Kinetics of corrosion inhibition of benzotriazole to copper in 3.5% NaCl

Bayoumi

Abdullah

Attia

2008

Materials & Corrosion

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The kinetics of interaction of benzotriazole (BTAH) with the surface of copper were studied using an electrochemical quartz crystal microbalance (EQMB) and electrochemical impedance spectroscopy (EIS). Upon injecting BTAH into the electrolyte, three regions appear in the time response of the microbalance. Region I (at short time scale of few minutes) exhibits rapid linear growth of mass with time. This is attributed to the formation of a Cu(I)BTA film that is several hundred layers thick. Region II reveals adsorption of BTAH at a slower rate, on the inner Cu(I)BTA complex. Region III is a plateau indicating that the BTAH film attains an equilibrium thickness, which increases with the concentration of BTAH. The polarization resistance of the interface changes with time in a similar fashion while the double layer capacitance decreases. The results suggest that the thickness of the physically adsorbed film of BTAH increases with time and BTAH concentration while the thickness of the inner Cu(I)BTA remains constant. Two semicircles were obtained in the impedance spectra corresponding to the complex Cu(I)BTA and the physically adsorbed BTAH.

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Localized corrosion effects and modifications of acidic and alkaline slurries on copper chemical mechanical polishing

Cited by 52 publications

References 12 publications

A quartz crystal microbalance study of the kinetics of interaction of benzotriazole with copper

A quartz crystal microbalance study of the kinetics of interaction of benzotriazole with copper

Electrochemical characterization of Cu dissolution and chemical mechanical polishing in ammonium hydroxide–hydrogen peroxide based slurries

Kinetics of corrosion inhibition of benzotriazole to copper in 3.5% NaCl

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