A quartz crystal microbalance study of the kinetics of interaction of benzotriazole with copper

Kharafi, F. M. Al; Abdullah, Aboubakr M.; Ateya, B. G.

doi:10.1007/s10800-007-9383-4

Cited by 9 publications

(7 citation statements)

References 52 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Comparing the initial potentials of the anodic peak in the presence (*-0.10 V) and absence (*0 V) of BTAH, it can be seen that the additive causes a shift of *100 mV in the positive direction. These findings indicate that adsorption of the additive and so the formation of Cu(I)BTA occurred, corroborating Kharafi et al [16]. Figure 2 shows a typical plot of the anodic to cathodic charge ratio (q a /q c ) against the switching potential, E k, during potentiodynamic experiments in the absence (j) and in the presence (m) of BTAH.…”

Section: Resultssupporting

confidence: 84%

“…The copper dissolution charge density in the presence of BTAH (218.75 mC cm -2 ) is lower than in its absence (543.75 mC cm -2 ), due to differences in nucleation potential, which is more negative in the presence of BTAH. Kharafi et al [16] attributed the remarkable efficiency with which BTAH inhibits the corrosion of copper to its adsorption on the surface (BTAH ? Cu = BTAH:Cu) and formation of a protective complex (BTAH ?…”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Voltammetric study of the influence of benzotriazole on copper deposition from a sulphuric plating bath

et al. 2008

View full text Add to dashboard Cite

Copper electrodeposition on to a platinum substrate from an acid sulphate plating bath was investigated with and without the additive benzotriazole (BTAH). In voltammetric experiments, the deposition process is shifted to more negative potentials in the presence of BTAH than in its absence from the bath. Moreover, the current density of the deposition process was higher in the presence of this additive than in its absence. With or without the additive, copper deposition showed features of nucleation in the voltammetric curves. Scanning electronic microscopy (SEM) images showed that copper deposits laid down in the presence of BTAH, for any potential and charge density studied, were smoother than in the absence of this additive. X-ray spectra indicated that the electrodeposits produced in the absence or presence of BTAH were composed of a mixture of copper, copper oxide and platinum oxide and also indicated that in the presence of BTAH, the deposit was less crystalline than in its absence.

show abstract

Section: Resultssupporting

confidence: 84%

Section: Resultsmentioning

confidence: 99%

Voltammetric study of the influence of benzotriazole on copper deposition from a sulphuric plating bath

et al. 2008

View full text Add to dashboard Cite

show abstract

“…XPS examination showed that the intensity of the N1s peak increased with the time of immersion, indicating more BTAH on the surface. Based on these findings, Al-Kharafi and co-workers [42] suggested the formation of a duplex inhibitor film composed of an inner thin layer of Cu(I)BTA and an outer layer of physically adsorbed BTAH which increases in thickness with time and BTAH concentration. On the other hand, the quartz crystal immittance (QCI) technique was used to characterize the film acoustic resistance and the resonator parallel capacitance [40].…”

Section: Introductionmentioning

confidence: 96%

“…For example, in case of a fresh Cu electrode immersed in BTAH solution, the observed low breakdown potential (E b = 20 mV) could be substantially increased (up to E b = 800 mV) after CV pretreatment with lower scan rates resulted in lower values of E b . On the other hand, Al-Kharafi and co-workers [42] distinguished three regions in the time response of the microbalance upon injecting BTAH into the electrolyte. At short time of few minutes (1st region), a rapid linear growth of mass with time was observed which was attributed to the formation of a protective Cu(I)BTA complex.…”

Section: Introductionmentioning

confidence: 99%

A review of the effects of benzotriazole on the corrosion of copper and copper alloys in clean and polluted environments

2009

View full text Add to dashboard Cite

A continuing challenge in materials design is the achievement of high operational efficiency through improvements in performance criterion, particularly its service life-time characteristics. Benzotriazole (BTAH) has now been in use for many years for the protection of copper and copper alloys against various forms of corrosion. In this review, the chemistry of BTAH and theories regarding its mode of action are summarized. Also, a survey of the reported work in both clean and polluted environments is documented. More interestingly, the adverse effect of BTAH on the corrosion of Cu and Cu alloys in sulfide polluted environments is introduced.

show abstract

“…Copper corrosion inhibition is the system that is studied most often [37][38][39][40][41][42]. G. Trabanelli et al [37], who studied the corrosion inhibition of copper by various heterocyclic compounds (BTA, 2,4-dimercapto-pyrimidine, 5-mercapto-1-phenyltetrazole, 1H-1,2,3-triazolo [4,5-b]pyridine) in 0.1 M NaCl concluded that "EQCM technique has a valuable part to play in the interpretation of corrosion and corrosion inhibition mechanisms".…”

Section: Adsorption Of Organic Cis On Metals From Neutral Aqueous Solmentioning

confidence: 99%

Organic corrosion inhibitors: where are we now? Part I. Adsorption

Kuznetsov

Frumḳin²,

Federation³

et al. 2015

Int. J. Corros. Scale Inhib.

View full text Add to dashboard Cite

A survey of studies on the adsorption of organic corrosion inhibitors (CIs) on metals from acid and neutral solutions for the period 2005-2015 is presented. It is noted that in order to estimate the adsorption of CI in corrosive acid solutions, the electrochemical impedance spectroscopy method (EIS) remains the most valuable. However, even the use of EIS for building CI adsorption isotherms is an approximation, which demands selecting the optimum conditions to reduce errors (control electrode potential, minimizing the rate of electrode dissolution, etc.). Besides, the conclusions about the state of the adsorption system and mechanism of adsorption of chemical substances can be made, at least, based on results of determining both the adsorption energy and the adsorption process kinetics. Addition of such a study to measure the aftereffect and XPS studies of the protective film formed on the metal by a CI provides valuable information about the nature of its adsorption.In reviewing studies of CI adsorption in neutral aqueous solutions, much attention is paid to the in situ ellipsometry method. It is noted that the best conditions for such investigations may be produced on the surfaces of electrodes at potentials corresponding to the absence of intense cathodic hydrogen evolution or anodic dissolution of the metal. Examples of CI adsorption measurements by other in situ methods (EIS and electrochemical quartz microbalance, EQMB), the results of which are consistent with those of ellipsometry, are discussed. Results of successful application of ellipsometry in combination with the XPS studies of protective layers on various metals in the study of not only individual CIs but also mixtures thereof are provided. Ellipsometric studies have played an important role in the discovery of a new possibility of using CIs, which consists in successive formation of adsorption layers of different CIs on a metal (layer-by-layer coating).

show abstract

A quartz crystal microbalance study of the kinetics of interaction of benzotriazole with copper

Cited by 9 publications

References 52 publications

Voltammetric study of the influence of benzotriazole on copper deposition from a sulphuric plating bath

Voltammetric study of the influence of benzotriazole on copper deposition from a sulphuric plating bath

A review of the effects of benzotriazole on the corrosion of copper and copper alloys in clean and polluted environments

Organic corrosion inhibitors: where are we now? Part I. Adsorption

Contact Info

Product

Resources

About