2017
DOI: 10.1002/pssa.201700411
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Long‐Time Thermal Stability Comparison of Alloyed and Non‐Alloyed Ohmic Contacts for InP‐Based HEMTs

Abstract: In this paper, the alloyed Ni/Ge/Au/Ge/Ni/Au and non-alloyed Ti/Pt/Au Ohmic contacts are developed for InP-based high electron mobility transistors (HEMTs). The optimal Ohmic contact resistance of 0.053 V mm has been achieved for the alloyed samples by annealing at 320 C for 30 s, and a good Ohmic contact with contact resistance of 0.058 V mm has been formed by Ti/Pt/Au structure without annealing. Considering the actual millimeterwave integrated circuit (MMIC) manufacture process, the long-time thermal stabil… Show more

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Cited by 6 publications
(3 citation statements)
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“…Figure 1 shows the schematic cross-section of InP-based HEMTs. The epitaxial structure with single Si-doping plane is almost consistent with previous device fabrication, [20,21] as shown in Fig. 1(a).…”
Section: Device Structure and Physical Modelsupporting
confidence: 87%
“…Figure 1 shows the schematic cross-section of InP-based HEMTs. The epitaxial structure with single Si-doping plane is almost consistent with previous device fabrication, [20,21] as shown in Fig. 1(a).…”
Section: Device Structure and Physical Modelsupporting
confidence: 87%
“…The detailed fabrication process has been described in our previous work. [20,21] Si To investigate the effect of proton radiation on the electrical characteristics of InP-based HEMT, the numerical simulation method has been used. [10] For devices with heterostructure, electrons can acquire very high energy and get into non-equilibrium transport condition, and therefore electron velocity can be much greater than their steady state value.…”
Section: Device Structure and Numerical Methodsmentioning
confidence: 99%
“…Figure 1b depicts a detailed vertical profile of a T-gate by scanning electron microscope (SEM). The detailed fabrication process has also been mentioned elsewhere in [22,23].…”
Section: Methodsmentioning
confidence: 99%