2017
DOI: 10.1109/jphotov.2017.2706424
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Low-Absorbing and Thermally Stable Industrial Silicon Nitride Films With Very Low Surface Recombination

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Cited by 46 publications
(16 citation statements)
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“…The deposition conditions and film properties of SiN x III, IV, and V are noted as recipe R2, R6, and R10 respectively, and described in details in Hameiri et al…”
Section: Methodsmentioning
confidence: 99%
“…The deposition conditions and film properties of SiN x III, IV, and V are noted as recipe R2, R6, and R10 respectively, and described in details in Hameiri et al…”
Section: Methodsmentioning
confidence: 99%
“…FZ silicon is often assumed to be stable and bulk defect-free, thus it has been used as control materials in many studies of defects or degradation phenomena in silicon grown by other techniques [5]- [7]. FZ silicon wafers are also frequently used for the studies of silicon surface passivation quality [8]- [10], and for the parameterization of This work is funded by Australian Government through Australian Centre for Advanced Photovoltaics (ACAP, project RG200768-G) and the Australian Renewable Energy Agency (ARENA; Project 2017/RND001). The views expressed herein are not necessarily the views of the Australian Government, and the Australian Government does not accept responsibility for any information or advice contained herein.…”
Section: Introductionmentioning
confidence: 99%
“…In order to investigate the effect of hydrogenation of the thermally-activated defects, another wafer from each group went through a silicon nitride (SiN x ) surface repassivation via PECVD. 17 The temperature of the deposition was around 425 °C. No additional firing has been done to the samples after the SiN x deposition.…”
Section: Methodsmentioning
confidence: 99%