Low-cost, High-Gain Antenna Module Integrating a CMOS Frequency Multiplier Driver for Communications at D-band

Manzillo, Francesco Foglia; González-Jiménez, José Luis; Clemente, Antonio; Siligaris, Alexandre; Blampey, B.; Dehos, Cédric

doi:10.1109/rfic.2019.8701772

Cited by 11 publications

(10 citation statements)

References 9 publications

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“…The bandwidth and gain of the 4×4 array are quite similar to the ones in [8] for the grid array antenna. Here, the array gain is higher than in [7], [20], [21] obviously due to higher number of elements. But, since the single-element gain here is about 7 dBi, it can be assumed that the gain of 2×2 arrays would also exceed the ones presented in [7], [20], [21].…”

Section: B Radiation Patternsmentioning

confidence: 75%

“…Here, the array gain is higher than in [7], [20], [21] obviously due to higher number of elements. But, since the single-element gain here is about 7 dBi, it can be assumed that the gain of 2×2 arrays would also exceed the ones presented in [7], [20], [21]. The main advantage of the proposed antenna design is the scalability for the future phased antenna arrays due to the isolated antenna elements.…”

Section: B Radiation Patternsmentioning

confidence: 75%

“…In more recent publications, the frequencies range around 10-60 GHz [13]− [19]. For D-band frequencies (110−170 GHz), cavity-backed patch antenna arrays on PCB were presented in [7], [20], [21]. The 2×2 arrays were designed as a primary source for a lens or a transmitarray.…”

Section: Introductionmentioning

confidence: 99%

“…to suppress surface waves. However, in our work all the patches are surrounded by a cavity whereas the cavity is placed around the 2×2 arrays in [7], [20], [21]. In this work, all array elements are identical and can be multiplied to a larger array of any size.…”

Section: Introductionmentioning

confidence: 99%

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Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band

Lamminen

Säily

Ala‐Laurinaho

et al. 2020

IEEE Open J. Antennas Propag.

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This paper presents the design, manufacturing, and characterization of a wide-band cavity-backed aperture-coupled patch antenna and a 16-element antenna array on multilayer printed circuit board (PCB) targeted for D-band applications. Microstrip line and grounded coplanar waveguide (GCPW) transmission lines are also designed and tested to investigate line losses at D-band. The test structures are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measurement results indicate an insertion loss of 1.9 dB/cm for the microstrip line and 1.8 dB/cm for the coplanar waveguide at 150 GHz. The measured maximum gains for single antenna and 16element array are respectively 7 dBi and 14 dBi at 143 GHz. The measured antenna input matching bandwidth is 20 GHz. The results show the viability of advanced printed circuit technology for D-band transmission lines, antennas, and antenna arrays.

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Section: B Radiation Patternsmentioning

confidence: 75%

Section: B Radiation Patternsmentioning

confidence: 75%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band

Lamminen

Säily

Ala‐Laurinaho

et al. 2020

IEEE Open J. Antennas Propag.

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“…16 channels of 7 Gbps can be aggragated in D-band transceiver. The data can be sent over a few tens of meter range using directive planar antennas, such as transmit arrays ( [5]), or over light plastic waveguide material ( [6]).…”

Section: Pos(ichep2020)832mentioning

confidence: 99%

Wireless Allowing Data and Power Transfer

Dehos¹,

Locci²,

Brenner³

et al. 2021

Proceedings of 40th International Conference on High Energy Physics — PoS(ICHEP2020)

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The WADAPT consortium (Wireless Allowing Data and Power Transfer) was created to study wireless (multi-gigabit) data transfer for high-energy physics applications (LoI, CERN-LHCC-2017-002; LHCC-I-028.-2017). Emerging millimetre wave technologies allow fast signal transfer and efficient partitioning of detectors in topological regions of interest. Large bandwidths are available at those frequencies, allowing very high data rates at short range and conveniently substituting a mass of materials (cables and connectors). The Wadapt initiative aims at building proof of concept for use in future HEP experiments. For vertex detectors at HL-LHC, the bandwidth of 60 GHz is adequate and commercial products are already available, providing 6 Gbps data links. Products have been tested for signal confinement, crosstalk, electromagnetic immunity and resistance to radiation. An HEP dedicated 60 GHz Integrated Chip is being built in Heidelberg, using 130 nm SiGe BICMOS technology. It should assess the feasibility and performance of the wireless link and establish solid foundation for designing the final reading system. At longer terms, 140 GHz bands could also be used for higher data rates (> 100 Gbps) for future FCC applications. Wireless reading could widespread to many detectors, with the possibility of adding intelligence on the detector to perform fourdimensional reconstruction of the traces and vertexes online, in order to attach the traces to their vertex with great efficiency even in difficult experimental conditions. The WADAPT project includes also a long-term step aimed at transmitting energy wirelessly. This would create a new paradigm for the transmission of data and power in particle physics detectors.

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