Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band

Abstract

This paper presents the design, manufacturing, and characterization of a wide-band cavity-backed aperture-coupled patch antenna and a 16-element antenna array on multilayer printed circuit board (PCB) targeted for D-band applications. Microstrip line and grounded coplanar waveguide (GCPW) transmission lines are also designed and tested to investigate line losses at D-band. The test structures are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measurement results indicate an insertion loss of 1.9 dB/cm for the microstrip line and 1.8 dB/cm for the coplanar waveguide at 150 GHz. The measured maximum gains for single antenna and 16element array are respectively 7 dBi and 14 dBi at 143 GHz. The measured antenna input matching bandwidth is 20 GHz. The results show the viability of advanced printed circuit technology for D-band transmission lines, antennas, and antenna arrays.

Cost-Effective High-Performance Air-Filled SIW Antenna Array for the Global 5G 26 GHz and 28 GHz Bands

“…Broadband antenna performance is achieved (i) by exploiting the low Q-factor of the air cavity and (ii) by resonant hourglass-shaped-aperture coupling to a resonant square patch in the air-filled metalized cavity. While [11] achieves a large bandwidth via an aperture-coupled patch topology, and [12]- [14] further extend it by using lowpermittivity substrates, they suffer from a footprint larger than λ 0 /2 × λ 0 /2. The metalized cavity in our topology reduces the antenna footprint to 0.48λ 0 × 0.48λ 0 at 26.875 GHz, by capacitively loading both resonant structures, and mitigates mutual coupling [15].…”

Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

“…In this case, the patch and the ground are defined on opposite copper layers of a double-side PCB. Finally, multilayer PCB was used for developing cavity-backed patch antennas [ 225 ], where the top layer includes the patch and one ground plane, the intermediate copper layers include ground planes, and the bottom layer is used to fabricate a microstrip copper line to feed the antenna. The PCBs are used to form a cavity to suppress the surface waves.…”

A D-Band Multichannel TX System-in-Package Achieving 84.48 Gb/s With 64-QAM Based on 45-nm CMOS and Low-Cost PCB Technology

“…Via-fence cavities around each patch can effectively mitigate this issue. This solution has been demonstrated even for PCB antennas at Dband, but its realization was enabled by a high-resolution semiadditive processing (mSAP) [19]. Instead, the design rules of the low-cost PCB technology selected in this work, hindered the realization of four cavities.…”