Low cost high performance microwave structures fabricated by advanced thick film techniques

Abstract

The paper presents the application of two advanced thick‐film techniques: etching of fired thick‐films and photoimaging of photosensitive thick‐films for fabrication bandpass microwave filters operating in the frequency range from 6 to 14 GHz. Modified screen printing through ultra‐thin calendered screens is used for comparative goals. Advanced techniques are combined with novel thick‐film conductors including photosensitive pastes and etchable pastes.

Printing parameters and ink components affecting ultra-fine-line gravure-offset printing for electronics applications

“…Thick films can be fine-patterned ($ 20 mm) with the use of Fodel inks, but this includes the slow steps associated with photo-chemistry. 1 Another alternative is ink-jet printing, 2 but this lacks in both speed and printed layer thickness. One promising method for cost effective printing of electronics is the use of gravure offset printing.…”

Noncontact Critical Dimension Metrology Sensor for Chrome Photomasks Featuring a Low-Temperature Co-Fired Ceramic Technology

“…The modern thick film LTCC technology, used to build three-dimensional IC modules by laminating green ceramic tapes that contain electronic cir- cuits and then cofiring the stacked layers at low temperature around 850 C, was chosen. Its advantages are a minimized parasitic capacitance and a maximized simplicity in building the sensor [7], since feedthroughs are easily obtained by punching through the ceramic tapes.…”

Lead-free photoimageable silver conductor paste formulation for high density electronic packaging

“…5a and b shows the low magnification 'Back-scattered' SEM micrographs corresponding to fired 100 m line/space and zigzag conductor pattern produced by using PSB4 (4% Bi 2 O 3 ) paste, respectively. The 100 m line/space pattern displays good edge definition and the zigzag pattern speculates a possibility of using these pastes in microwave applications [6,10]. Fig.…”

“…The volition to use Bi 2 O 3 was mainly due to its commercial availability in terms of no special preparation requirements (normally associated with glass-frit formation). Furthermore, it has been extensively reported [4][5][6] in the context of standard thick film pastes that Bi 2 O 3 forms an eutectic bond with Alumina substrate and the resultant transient liquid promotes adhesion of the conductor film with the substrate.…”