Low-cost laser modules for SMT

Rehm, W.; Adam, K.; Goth, A.; Weller, Jörg; Lauckner, J.; Scherb, J.; Aribaud, P.; Artigue, C.; Duchemin, C.; Fernier, B.; Grard, E.; Keller, D.; Kerboeuf, Sylvaine; Rabaron, S.; Rainsant, J.M.; Trégoat, Denis; Nicque, J.L.; Tournereau, A.; Laroulandie, P.J.; Berthier, P.

doi:10.1109/ectc.2000.853241

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

DOI: 10.1109/ectc.2000.853241

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Low-cost laser modules for SMT

W. Rehm

K. Adam²,

A. Goth³

et al.

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Cited by 7 publications

(1 citation statement)

References 16 publications

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“…It has further been shown that passive assembly for laser modules using the self alignment mechanism in combination with stops is viable. Stops for vertical alignment and stand offs for lateral alignment have been used by Rehm 3 The work presented here has been aimed at developing a flip chip technology for laser diodes on a planar light guide circuit (PLC) which acts as a pump combiner. The post bond alignment accuracy between the laser diodes and the wave guides of the PLC has to be single mode compatible in all directions and has to be achieved by passive alignment.…”

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confidence: 99%

Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops

et al. 2005

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Assembly of single mode laser diodes requires a post bond alignment accuracy of less than 1 µm. The implementation of passive alignment in optoelectronics packaging is still a challenge. A low cost approach to achieve such high precision alignment is using the flip chip self alignment mechanism in combination with micro-mechanical stops. In order to prove that this approach is feasible test vehicles were designed and fabricated. This paper presents the concept of passive alignment pursued, the experimental setup and results thereof. The design of the test vehicles is described including the bump design as well as bumping and flip chip assembly process.

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Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops

et al. 2005

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SOA-based optical network components

Renaud¹,

Keller²,

Sahri³

et al.

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)

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High reliability 2.5 Gbit/s modules using silicon platform technology

Reygrobellet

Volto²,

Hernandez³

et al.

53rd Electronic Components and Technology Conference, 2003. Proceedings.

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This article deals with the qualification principles used to assess the reliability of 2.5 GbiUs optical modules developed with the Alcatcl Optronics Planar technology. Detailing the tests chosen to validate several technical options. an early rcliabilih assessnicnt method is discussed and illustrated on two different modules witli regard to qualification results obtained on standard Telcordia tests.lntroductionThe Alcatel Optronics planar t e c l m o l o~ refers to the use of silicon platfonns, which brings numerous advantages.Firstly. it allows significant cost reductions tllanks to assembling automation, IMSS production capacity and cheaper raw material. Secondly. it gives the possibility to miniaturize the products Uuougbout the integration of several functions on the sane silicon motherboard (laser diode. monitoring photodiode. ..). Moreover. mastering the teclmologics linked with tlie use of silicon platfomi also opens the way to more coinples hybridization. Optical routing and switching functions can be implemented on silica on silicon platforms, using the active chips soldering process, the fibering and the coupling lens inounting teclmologies already developed for basic silicon motherboard. As esaniples. demonstrations of ultra compact and low cost 8sl wavelength combiner and amplified demus module have been proposed by Alcatel Optronics at ECOC 2002, integrating photodetectors arrays: planar MOEM devices? SOA clups and Arrayed Waveguide Grating (AWG) on hybrid silica on silicon platforms. The research efforts on optical devices using silicon optical bench have been quite intensive during tlie last decade. Most of the papers published along tlus period focused on the silicon platform design and manufacturing techniques, llie laser and/or detector chips aligrunent concerns, the optical coupling tolerances and perfonnances, or the fibering process [1][2][3][4][5]. More recently, since approximately five years, several announcements were made on the realization of either complete emitter or receiver modules, with attractive results in terms of perfonnances, potential cost reduction, and compactness [61[7]. Nevertheless, few papers really insisted on the reliability concerns and generally only focused on some specific results [SI, or described a status on standard qualification tests without further detail on measured parameters and failure criteria [9]. Besides, today's commercial offer is not so wide for components based on silicon assembly technology, suggesting that manufacturing and reliability control of that prodiict is no1 so easy to master. Qualification of building blocksMany technological building blocks were proposed for coinponents based on silicon platform: which may lead to various teclmical options during the product development and transfer to manufacturing. For instance, the choice of the mounting technique of the active chips on the Si submount usually balances between full self-aligrunent process and mnacldne-assisted positioning (vision system with refercnce riducials on submount and/or ...

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Low-cost laser modules for SMT

Cited by 7 publications

References 16 publications

Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops

Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops

SOA-based optical network components

High reliability 2.5 Gbit/s modules using silicon platform technology

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