Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting

Martens, Stefan; Krueger, B.; Mack, Walter; Voelklein, Friedemann; Wilde, Jürgen

doi:10.1016/j.microrel.2008.06.033

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Cited by 4 publications

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“…Examples are sensors for cellular phones or for electronic video-game controllers. The trend in ICs towards the system-in-a-package or system-on-a-package (SiP/SoP) has lead to the development of multi-chip packages [3]. Using this technique highly functional systems can be built by combing sensors with analogue and digital circuits.…”

Section: Standard Packagesmentioning

confidence: 99%

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B4.1 - Trends in Assembly and Packaging of Sensors

Wilde¹

2009

Proceedings SENSOR 2009, Volume I

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Section: Standard Packagesmentioning

confidence: 99%

“…Stacked-chip packages for SiP (System-in-Package) of hybrid-sensor systems (courtesy of Infineon AG). Above: principle of chip stacking and interconnection[3], below: metallographic cross section.…”

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confidence: 99%