Low-cost technology for multilayer electroplated parts using laminated dry film resist

Lorenz, Hubert; Paratte, L.; Luthier, R.; Rooij, N. F. de; Renaud, Philippe

doi:10.1016/0924-4247(96)01171-5

Cited by 45 publications

(28 citation statements)

References 5 publications

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“…Dry film resists, which were developed for the printed circuit board industry, are of interest for MEMS applications because they offer ease of application, good thickness uniformity, and film thicknesses up to several hundred m. 33,34 Resist films of 100 m thickness were laminated onto 4 in. diam silicon wafers, and crosslinked prior to ablation by flood exposure in a UV contact printer.…”

Section: Resultsmentioning

confidence: 99%

Excimer laser ablation of microstructures: A numerical model

Paterson

Holmes

Smith

1999

Journal of Applied Physics

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A new model for the ablation of microstructures with excimer laser radiation is presented. The model is based on an interactive two-step approach. The local distribution of the light over the developing structure is evaluated for each pulse. This distribution is then used to calculate the local etch rate, and hence the change to the structure. Despite the assumptions inherent in the model, in particular assumptions made about the propagation of the light through a developing structure and about the etching behavior of the materials, results from the model agree with actual aspects of ablated structures. The model has been used with some success to predict the wall angles of trench structures ablated using partially coherent illumination from a fly's eye homogenizer. Predictions of the model show good agreement with the experiment results. In particular, the model correctly predicts the variation of the wall angles with incident fluence and also predicts structures with well defined wall angles over depths much greater than the depth of focus of the image.

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Section: Resultsmentioning

confidence: 99%

Excimer laser ablation of microstructures: A numerical model

Paterson

Holmes

Smith

1999

Journal of Applied Physics

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“…And, various other names had been given for this process such as 3D UV-microforming (Loechel 2000;Kohlmeier et al 2002), LIGA like (Guckel et al 1990) and low-cost LIGA or poor man's LIGA (Lorenz et al 1996). Many UV-sensitive thick resists, including positive tone such as AZ 4562 (Clariant) (Loechel 2000), AZ 9260 (Kohlmeier et al 2004), ma-P 100 (Micro Resist Technology) (Loechel 2000) and negative tone such as (Loechel 2000) and various dry films (Lorenz et al 1996), have been chosen as electroforming mould for this non-X-ray microforming process. By this technique, a lot of micro-components have been realized like gearwheel (Cuiy and Lawes 1997), comb structures (Cuiy and Lawes 1997), microtip (Lennon and Ayela 2002), micro-coil or micro-solenoid (Loechel 2000) for actuators or sensors application in MEMS.…”

Section: Introductionmentioning

confidence: 98%

“…It has been designed to deliver small and precise volumes of liquid. This paper presents the fabrication of a nickel-made valve-less (Andersson et al 2001) micropump by the UV-LIGA multilevel electroforming technology (Lorenz et al 1996;Gobet et al 1993). And, based on its design and process, a liquid microejector is successfully fabricated and worked.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of components for a valve-less micropump or microejector by multilevel electroforming technology

2006

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Both the workable micropump and microejector actuated by the shear mode PZT actuators are successfully fabricated. They are based on a similar design and the same process that uses UV-LIGA multilevel electroforming technology. The micropump consists of a vibration plate and a chamber plate while the microejector consists of the same vibration plate and a nozzle plate. The AZ 9260 positive photoresist is used as the electroforming mould. The two alternating steps, the photoresist patterning and nickel electroforming, make components form a quasi 3D (or 2.5D) multilevel microstructure. An over-electroforming technique is employed to form the nozzles in nozzle plate for the microejector. Some useful experimental data about the over-electroforming are proposed to predict and control the orifice diameter. The volume change of the chamber is estimated by both the numerical solution and actual measurement. The liquid ejection of the microejector is observed by a visualization system.

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“…Chung et al (2004a) demonstrated a novel monolithic off-shooter droplet generator by two-step photolithography with two kinds of thick photoresists, SU-8 and JSR, and one-step nickel electroplating process. Multilayer structures of electroplated nickel microgears were also fabricated using electroplating with intermediate seed layers for four-layer (Lorenz et al 1996). A hybrid approach consisting of laser patterning of laminated resist layers and electroplating with intermediate seed layers was used to fabricate multilayer three-dimensional structures (Holmes 2002).…”

Section: Introductionmentioning

confidence: 99%

Effect of seed layer stress on the fabrication of monolithic MEMS microstructure

et al. 2006

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This paper reported the effect of seed layer stress on the fabrication of monolithic polymer-metal MEMS microstructure and what is a better material for the seed layer. The monolithic microstructure is gaining more and more attentions in MEMS application, especially in three-dimensional microstructure and inkjet printhead. The polymer-metal MEMS microstructure can be fabricated by combining the lithography and electroforming technologies. It is an integrated technology by batch process at low cost. The metal seed layer with large stress will lead to cracks and failure during the process integration. Several metal materials and thicknesses were studied to find a better candidate as the seed layer for the monolithic MEMS microstructure. The relationship between the monolithic MEMS structure and seed layer selection is also discussed. The lower residual stress of seed layer will result in a better surface condition for the followed integration process. The pure Ti metal and two-layer Ti/Au composite are the better seed layer materials in this study for the followed electroforming process of the monolithic polymer-metal MEMS microstructure.

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Low-cost technology for multilayer electroplated parts using laminated dry film resist

Cited by 45 publications

References 5 publications

Excimer laser ablation of microstructures: A numerical model

Excimer laser ablation of microstructures: A numerical model

Fabrication of components for a valve-less micropump or microejector by multilevel electroforming technology

Effect of seed layer stress on the fabrication of monolithic MEMS microstructure

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