This paper describes the characterization of a home-made negative photoresist developed by IBM. This resist, called SU-8, can be produced with commercially available materials. Three blends were prepared for this article and some of its optical and mechanical properties are presented. One of its numerous advantages is the broad range of thicknesses which can be obtained in one spin: from 750 nm to 450 µm with a conventional spin coater. The resist is exposed with a standard UV aligner and has an outstanding aspect ratio near 15 for lines and 10 for trenches. These ratios combined with the electroplating of copper allow the fabrication of highly integrated electromagnetic coils.

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An innovative method for fabrication and rapid prototyping of high-aspect ratio micromechanical components in photoresist is discussed. The photoresist is an epoxynegative-tone resist, called SU-8, which can be structured to more than 2 mm in thickness by UV exposure. Small gears of 530 m in diameter and 200 m in thickness have been realized in this photoplastic and their functionality has been demonstrated. In addition a process called MIMOTEC TM (MIcroMOlds TEChnology) has been established for the fabrication of metallic micromolds. MIMOTEC TM is based on the use of the SU-8 spun on high thicknesses and electrodeposition of nickel. Thermoplastic microcomponents have been injected and mounted in watches.