Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist

Lorenz, Hubert; Despont, M.; Vettiger, P.; Renaud, Philippe

doi:10.1007/s005420050118

Cited by 133 publications

(75 citation statements)

References 7 publications

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“…The most common of these materials is the epoxy polymer SU-8 that has been used to make separation systems, microreactors, valves, microneedles, polymerase chain reaction (PCR) chips, cell growth substrates and other microfluidic and biomedical microelectromechanical systems (BioMEMS) devices [1][2][3]. Thicknesses of SU-8 range from sub-micrometer to hundreds of micrometers.…”

Section: Introductionmentioning

confidence: 99%

Laser Direct Writing of Thick Hybrid Polymers for Microfluidic Chips

et al. 2014

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This work presents patterning of thick (10-50 µm) hybrid polymer structures of ORMOCER ® by laser direct writing. ORMOCER ® combine polymer-like fabrication processes with glass-like surface chemistry that is beneficial for many bio-microfluidic applications. ORMOCER ® is liquid before exposure, so patterning is done by contact-free lithography, such as proximity exposure. With laser direct writing, we obtained higher resolution patterns, with smaller radius of curvature (~2-4 µm), compared to proximity exposure (~10-20 µm). Process parameters were studied to find the optimal dose for different exposure conditions and ORMOCER ® layer thicknesses. Two fluidic devices were successfully fabricated: a directional wetting device (fluidic diode) and an electrophoresis chip. The fluidic diode chip operation depends on the sharp corner geometry and water contact angle, and both have been successfully tailored to obtain diodicity. Electrophoresis chips were used to separate of two fluorescent dyes, rhodamine 123 and fluorescein. The electrophoresis chip also made use of ORMOCER ® to ORMOCER ® bonding.

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Section: Introductionmentioning

confidence: 99%

Laser Direct Writing of Thick Hybrid Polymers for Microfluidic Chips

et al. 2014

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“…SU8 is a well-known thick photoresist used in fabrication of MST and MEMS systems [1][2][3]. However, it is hard to get fine patterns with high aspect ratio structures because of high internal stress [4].…”

Section: Introductionmentioning

confidence: 99%

Effect of filler behavior on nanocomposite SU8 photoresist for moving micro-parts

Jiguet¹,

Judelewicz²,

Mischler

et al. 2006

Microelectronic Engineering

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“…SU-8 can be easily fabricated three dimensional micro components with several tens microns in thickness using UV photolithographic technique, although it is difficult for common photoresist to fabricate such a threedimensional fine patterns [12]. SU-8 is utilized as permanent materials for micro fluidics, wave guide, soft cantilever, etc.…”

Section: Materials and Fabrication Detailsmentioning

confidence: 99%

Influence of Heat-Treatment on the Adhesive Strength between a Micro-Sized Bonded Component and a Silicon Substrate under Bend and Shear Loading Conditions

Ishiyama

2012

Journal of the Korean Society for Nondestructive Testing

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Adhesive bend and shear tests of micro-sized bonded component have been performed to clarify the relationship between effects of heat-treatment on the adhesive strength and the bonded specimen shape using Weibull analysis. Multiple micro-sized SU-8 columns with four different diameters were fabricated on a Si substrate under the same fabrication condition. Heat-treatment can improve both of the adhesive bend and shear strength. The improvement rate of the adhesive shear strength is much larger than that of the adhesive bend strength, because the residual stress, which must change by heat-treatment, should effect more strongly on the shear loading. In case of bend type test, the adhesive bend strength in the smaller diameters (50 and 75 ) widely vary, because the critical size of the natural defect (micro-crack) should vary more widely in the smaller diameters. In contrast, in case of shear type test, the adhesive shear strengths in each diameter of the columns little vary. This suggests that the size of the natural defects may not strongly influence on the adhesive shear strength. All the result suggests that both of the adhesive bend and shear strengths should be complicatedly affected by heat-treatment and the bonded columnar diameter.

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Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist

Cited by 133 publications

References 7 publications

Laser Direct Writing of Thick Hybrid Polymers for Microfluidic Chips

Laser Direct Writing of Thick Hybrid Polymers for Microfluidic Chips

Effect of filler behavior on nanocomposite SU8 photoresist for moving micro-parts

Influence of Heat-Treatment on the Adhesive Strength between a Micro-Sized Bonded Component and a Silicon Substrate under Bend and Shear Loading Conditions

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