3D microfabrication by combining microstereolithography and thick resist UV lithography

Bertsch, Arnaud; Lorenz, Hubert; Renaud, Philippe

doi:10.1016/s0924-4247(98)00249-0

Cited by 163 publications

(88 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Yet another approach is the use of colored masks as demonstrated by Taff and colleagues [36], where they first characterized the UV absorption of different colors and then printed them on transparent film using a standard laser color printer. Other approaches include moving mask lithography [37], tilting and rotation of the substrate stage [38]; holography [39,40] and stereolithography [41].…”

Section: Grayscale Photolithographymentioning

confidence: 99%

SU-8 Photolithography as a Toolbox for Carbon MEMS

Martínez-Duarte

2014

Micromachines

View full text Add to dashboard Cite

Abstract:The use of SU-8 as precursor for glass-like carbon, or glassy carbon, is presented here. SU-8 carbonizes when subject to high temperature under inert atmosphere. Although epoxy-based precursors can be patterned in a variety of ways, photolithography is chosen due to its resolution and reproducibility. Here, a number of improvements to traditional photolithography are introduced to increase the versatility of the process. The shrinkage of SU-8 during carbonization is then detailed as one of the guidelines necessary to design carbon patterns. A couple of applications-(1) carbon-electrode dielectrophoresis for bioparticle manipulation; and (2) the use of carbon structures as micro-molds are also presented.

show abstract

Section: Grayscale Photolithographymentioning

confidence: 99%

SU-8 Photolithography as a Toolbox for Carbon MEMS

Martínez-Duarte

2014

Micromachines

View full text Add to dashboard Cite

show abstract

“…As each spot exposes the photoresist, the beam write time or exposure intensity is adjusted to control the dose and achieve variable-relief structures. Finally, 2-photon microsterolithography [19,[24][25][26] While the above lithographic techniques enable realization of a wider variety of structures compared to multiple-exposure photolithography, longer fabrication times and the need for specialized equipment makes this technology less applicable when high throughput is required.…”

Section: Direct-write Photolithographymentioning

confidence: 99%

Double-Exposure Grayscale Photolithography

Mosher

Waits

Morgan

et al. 2009

J. Microelectromech. Syst.

View full text Add to dashboard Cite

Three-dimensional (3D) photoresist structures may be realized by controlling the transmitted UV light intensity in a process termed gray-scale photolithography.Light modulation is accomplished by diffraction through sub-resolution pixels on a photomask. The number of photoresist levels is determined by the number of different pixel sizes on the mask, which is restricted by mask fabrication. This drawback prevents the use of gray-scale photolithography for applications that need a high vertical resolution.The double-exposure gray-scale photolithography technique was developed to improve the vertical resolution without increasing the number of pixel sizes. This is achieved by using two gray-scale exposures prior to development. The resulting overlay produces an exposure dose that is a combination of both exposures.Calibration is utilized to relate the pixel sizes and exposure times to the photoresist height. This calibration enables automated mask design for arbitrary 3D structures and investigation of other effects, such as misalignment between the exposures.

show abstract

“…Microstereolithography [23] is a method of creating 3D SU-8 (a photosensitive polymer) molds by consecutively depositing and patterning many thin SU-8 layers one at a time. Using many patterning steps, 3D structures can be made, but the process becomes quite time consuming.…”

Section: Dimensional Mems Fabricationmentioning

confidence: 99%

Development of a Deep Silicon Phase Fresnel Lens Using Gray-Scale Lithography and Deep Reactive Ion Etching

Morgan

Waits

Krizmanic

et al. 2004

J. Microelectromech. Syst.

127

View full text Add to dashboard Cite

A phase Fresnel lens (PFL) could achieve higher sensitivity and angular resolution in astronomical observations than the current generation of gamma and hard x-ray instruments. For ground tests of a PFL system, silicon lenses must be fabricated on the micro-scale with controlled profiles to enable high lens efficiency. Thus, two MEMS-based technologies, gray-scale lithography and deep reactive ion etching (DRIE), are extended to create multiple controlled step heights in silicon on the necessary scale.A Gaussian approximation is introduced as a method of predicting a photoresist gray level height given the amount of transmitted light through a grayscale optical mask. Etch selectivity during DRIE is then accurately controlled by introducing an oxygen-only step to a standard Bosch cycle to produce the desired scaling factor between the photoresist and silicon profiles. Finally, a profile evaluation method is developed to calculate the expected efficiency of measured silicon profiles. Calculated efficiencies above 87% have been achieved.

show abstract

3D microfabrication by combining microstereolithography and thick resist UV lithography

Cited by 163 publications

References 11 publications

SU-8 Photolithography as a Toolbox for Carbon MEMS

SU-8 Photolithography as a Toolbox for Carbon MEMS

Double-Exposure Grayscale Photolithography

Development of a Deep Silicon Phase Fresnel Lens Using Gray-Scale Lithography and Deep Reactive Ion Etching

Contact Info

Product

Resources

About