Low cycle fatigue of thin copper foils

Hong, Sanki; Weil, R.

doi:10.1016/0040-6090(95)08225-5

Cited by 81 publications

(23 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Their best fit values of the fatigue exponent, b, are much smaller than those we obtained. For example, in the fatigue study of copper foils by Hong and Weil [50], the amplitude of stress modulation was designed to vary from 0 to 90% of the ultimate tensile strength in Fig. 12 Mean stress versus the number of cycles for beams of 900 nm thick copper film fatigued with σ a =20 MPa and σ m ranging from 114 MPa to 600 MPa.…”

Section: Discussion and Comparison With Other Thin Film Fatigue Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Novel Microtensile Method for Monotonic and Cyclic Testing of Freestanding Copper Thin Films

Lin¹,

Tong²,

Shiu³

2009

Exp Mech

View full text Add to dashboard Cite

This paper presents the results of new microtensile tests conducted to investigate the mechanical properties of submicron-thick freestanding copper films. The method, used in this study, allows the observation of materials response under uniaxial tensile loads with measurements of stress at strain rates up to 5.5 x 10(-4)/s. It also facilitates tension-tension fatigue experiments under a variety of mean stress conditions at cyclic loading frequencies to 20 Hz. The sample processes involve fabrication of a supporting frame with springs and alignment beams all made of electroplated nickel. Electroplating took place on top of a previously deposited sample rather than creating a structure by subtractive fabrication. Tensile sample loading is applied using a piezoelectric actuator. Load was measured using a capacitance gap sensor with a novel mechanical coupling to the sample. Tension-tension fatigue experiments were carried out with feedback to give load control. Fatigue tests were conducted on sputter-deposited 500 and 900 nm copper films with grain sizes similar to 50 nm. Fatigue life reached 10(5) cycles at low mean load, which decreased with an increase in the mean load. The results indicate decreasing plasticity with increasing mean load

show abstract

Section: Discussion and Comparison With Other Thin Film Fatigue Resultsmentioning

confidence: 99%

“…Previous studies of fatigue in thin metal films [48,50,51] characterized their measured stress-life behavior using a modified Basquin equation [49] similar to equation (1). Their stress-time protocols for fatigue involved large and variable cyclic stress.…”

Section: Discussion and Comparison With Other Thin Film Fatigue Resultsmentioning

confidence: 99%

Novel Microtensile Method for Monotonic and Cyclic Testing of Freestanding Copper Thin Films

Lin¹,

Tong²,

Shiu³

2009

Exp Mech

View full text Add to dashboard Cite

show abstract

“…In the end, the hardening exponent, n, was held constant in this study. Engelmaier [14] and Hong and Weil [30] show that the sensitivity to the cyclic changes in n is very small compared to that of K. Also held constant is the elastic modulus, E, for the same reason. Fig.…”

Section: Literature Reviewmentioning

confidence: 95%

“…Hong and Weil [30] performed a study investigating the fatigue properties of copper foils electrodeposited on chromium mirrors to the dimensions typically found in printed circuits. These experiments were uniaxial tensile tests.…”

Section: Literature Reviewmentioning

confidence: 99%

An adaptive Cu trace fatigue model based on average cross-section strain

Farley

Zhou

Dasgupta

et al. 2012

Microelectronics Reliability

View full text Add to dashboard Cite

“…For example, studies on pressure die casting dies [1,2] show that the surface damage in tool steels extends from the 300 µm into the bulk material (this thickness will hereafter be referred to as the "surface"). It is also known that the properties of materials of low thickness may be different from those of bulk materials [3][4][5]. It is thus proposed to study the crack initiation and propagation behaviour of the surface separately from the bulk Figure 1.…”

Section: An Investigation Of the Crack Propagation In Tool Steel X38cmentioning

confidence: 99%

An investigation of the crack propagation in tool steel X38CrMoV5 (AISI H11) in SET specimens

Shah¹,

Boher²,

Leroux³

et al. 2009

Rev. Met. Paris

View full text Add to dashboard Cite

OATAO is an open access repository that collects the work of Toulouse researchers and makes it freely available over the web where possible. This is an author-deposited version published in : http://oatao.univ-toulouse.fr/ Eprints ID : 2933 Any correspondence concerning this service should be sent to the repository administrator: staff-oatao@listes-diff.inp-toulouse.fr AbstractA method is proposed for the evaluation of surface fatigue damage of hot forming tools that undergo severe thermo mechanical loading. Crack propagation under fatigue loading in a X38CrMoV5-47HRC is investigated using specimens of 2.5*8 mm*mm section. The effect of thickness on crack propagation is investigated. The crack propagation experiments are performed at different R values on single-edge cracked tension s curves are established. Short crack propagation in thin specimens is also investigated. Numerical simulation and analysis of the specimens is performed by ABAQUS® Standard software. Evolution of the J integral with respect to the crack length is investigated. Crack closure along the whole crack length is observed by a microscope. Effect of slip bands on crack propagation mechanism is investigated.

show abstract

Low cycle fatigue of thin copper foils

Cited by 81 publications

References 7 publications

Novel Microtensile Method for Monotonic and Cyclic Testing of Freestanding Copper Thin Films

Novel Microtensile Method for Monotonic and Cyclic Testing of Freestanding Copper Thin Films

An adaptive Cu trace fatigue model based on average cross-section strain

An investigation of the crack propagation in tool steel X38CrMoV5 (AISI H11) in SET specimens

Contact Info

Product

Resources

About