Low‐Dielectric Constant and Low‐Temperature Curable Polyimide/POSS Nanocomposites

Abstract

With the rapid development of ultra large scale integrated circuits, low stress, low thermal expansion, low dielectric constant, and low temperature curable (<250 °C) polyimides (PIs) with excellent mechanical, thermal properties are required. Unfortunately, high curing temperatures above 300 °C and limited dielectric property still remain to be solved. Herein, a new type of aminopropyl isobutyl polysilsesquioxane (POSS) with single vertex activity is introduced by in situ polymerization resulting in the PI‐POSS nanocomposites which exhibit a low dielectric constant (κ ≤ 2.6). Furthermore, low‐temperature curing at 200 °C (99.4% imidization) under the catalysis of quinoline is also achieved. The as‐prepared PI‐POSS nanocomposites also show excellent mechanical properties of which the tensile strength can reach up to 148 MPa and the elongation at break achieves 98%. Moreover, the temperature of weight loss 5% is as high as 550 °C and the glass transition temperature can also reach 349 °C. The as‐prepared PI‐POSS nanocomposites prove excellent electrical performance and mechanical properties, showing a huge market prospect of 5G chip packaging and millimeter wave antenna in the future.

Fluorinated graphene/polyimide nanocomposites for advanced electronic packaging applications

“…In the second way, air void structures were introduced into PI matrix to reduce dielectric constant and loss, as the dielectric constant ( ε ) of air is approximately 1.0 22,23 . Among them, Kung‐Hwa Wei et al 16,24 and our group 25 brought polyhedral oligomeric silsesquioxane (POSS) into the PI, greatly decreasing the permittivity. However, the mechanical properties of PI with porous structure are severely impaired for interlayer dielectric (ILD) material applications.…”

POSS‐inducedrheological and dielectric modification of polyethersulfone

“…Multiple researchers have suggested that nanoparticles such as POSS, which have a hollow, porous core and high steric volume, increase the space between polymer chains and reduce inter‐polymer interactions, resulting in an increase in free volume in the nanocomposites 51–57 . The lower dipole strengths and the decreased number density of effective dipoles (reduced dielectric relaxation strength) seen in the PES/POSS blends could be attributed to an increase in free volume.…”

“…Multiple researchers have suggested that nanoparticles such as POSS, which have a hollow, porous core and high steric volume, increase the space between polymer chains and reduce inter-polymer interactions, resulting in an increase in free volume in the nanocomposites. [51][52][53][54][55][56][57] The lower dipole strengths and the decreased number density of effective dipoles (reduced dielectric relaxation strength) seen in the PES/POSS blends could be attributed to an increase in free volume. Other groups propose that favorable interactions between the nanoparticles and the polymer matrix confine and immobilize the polymer chains at the nanoparticlepolymer interface and thus diminish the polarizability and dielectric relaxation strength of the polymer matrix.…”

Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

“…S1(a). † The characteristic absorption peak of EPPOSS@Gh-BN is detected at 1116 cm À1 , which is evidence of the presence of Si-O-Si vibration, 40 conrming that EPPOSS was successfully graed onto the surface of Gh-BN. The formation of EPPOSS by VIPOSS epoxidation reaction was conrmed by the absorption peaks at 1604 cm À1 (-C]C vibration) and 870 cm À1 (C-O-C symmetric and asymmetric stretching vibration), as shown in Fig.…”

“…38 Polyhedral oligomeric silsesquioxane (POSS) is an organicinorganic hybrid nanomaterial that has been widely studied as an effective ller for low dielectric polymer composites owing to its unique hollow structure. 39,40 In particular, the inorganic cubic-cage core provides mechanical properties. 41 Guo et al 42 used KH560 to modify h-BN, and then combined the amino group on the NH 2 -POSS molecule with the epoxy group on KH560 to obtain POSS-modied h-BN (f-BN) successfully.…”