Low dielectric constant materials for interlayer dielectric

Treichel, H.; Ruhl, G.; Ansmann, P.; Würl, R.; Müller, Christine H.; Dietlmeier, Marcus

doi:10.1016/s0167-9317(97)00185-8

Cited by 99 publications

(48 citation statements)

References 24 publications

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“…Materials with low dielectric constant and dielectric loss are widely employed in the integrated circuit field. [5] Previous reports showed that low dielectric constant of polymer materials could be achieved by incorporating ZnO inorganic filler [4,6] and by having large substituent groups, cross-linked PI or perfluoro groups. [7][8][9][10][11][12][13] Recent development in layered silicates/PI composites indicates that these composites possess excellent mechanical properties, thermal stability, and gas barrier properties.…”

Section: Introductionmentioning

confidence: 99%

Dielectric Properties of Polyimide‐Mica Hybrid Films

Zhang

Dang

Xin

et al. 2005

Macromol. Rapid Commun.

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Summary: Polyimide‐mica hybrid films were prepared via ultrasonic dispersion and in situ polymerization process from a solution of a polyimide precursor and mica in N,N‐dimethylacetamide, and their structure was characterized by FTIR and XRD techniques. The dependence of dielectric properties, such as dielectric constant and electrical breakdown strength, of the hybrid films on the content of mica was studied at room and cryogenic temperatures. The results show that the dielectric constant of PI‐mica hybrid films decreases with the increase of the mica content at temperatures from −150 to 150 °C and at frequency range from 1 kHz to 1 MHz. It was found that the cryogenic electrical breakdown strength of the PI‐mica hybrid films could meet the requirements of cryogenic insulating materials.Effect of frequency on the dielectric constant of PI‐mica hybrid films at 140 °C at the frequency from 1 kHz to 1 MHz.magnified imageEffect of frequency on the dielectric constant of PI‐mica hybrid films at 140 °C at the frequency from 1 kHz to 1 MHz.

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Section: Introductionmentioning

confidence: 99%

Dielectric Properties of Polyimide‐Mica Hybrid Films

Zhang

Dang

Xin

et al. 2005

Macromol. Rapid Commun.

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“…Hence, selectivity of SiO 2 and etching rates are extremely important during an etching process. [9,10] Though the development of plasma etching reactors and processes that is strongly based on trial-and-error method has been shown to be satisfactory for industrial purpose, it may become difficult and less efficient as more complicated chamber design and process is required. Besides, measurements of plasma properties in an ICP chamber are generally difficult and expensive, while plasma modeling could be an invaluable tool for understanding the details of related complex plasma physics and chemistry.…”

Section: Introductionmentioning

confidence: 99%

Parallel 2D Axisymmetric Fluid Modeling of CF₄ Discharge in an Inductively Coupled Plasma Source During SiO₂ Etching

Chiu¹,

Chiang

Hung³

et al. 2014

Plasma Processes & Polymers

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A parallel 2D axisymmetric plasma fluid modeling for an inductively coupled plasma source with tetrafluoromethane precursor is reported. In total, 32 species with 96 gas-phase and 27 surface reactions with site-balance equations are considered. The predicted results of major species densities are in reasonable agreement with reported experiments. The etching products, e.g. SiF x and O 2 , are found to be appreciable ($10%) compared to the precursor near the substrate. The predicted density trends, such as CF x þ and CF x (x ¼ 1-3), are also consistent with reported experiments. Finally, the predicted etching rate on the SiO 2 substrate is presented and discussed in detail.

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“…Although a variety of potential candidates has been reported in the literature during the past decade, integration is the deciding factor driving the selection of the most promising materials for a given technology node [1]. For instance, the industry flirted briefly with organic polymers [2][3][4][5][6][7]. Besides the anticipated thermal stability challenges, this class of materials, known to be tough and crack-resistant, had other issues, such as softness, large coefficient of thermal expansions (CTE) and delamination.…”

Section: Introductionmentioning

confidence: 99%