Low-energy pulsed laser treatment of silver nanoparticles for interconnects fabrication by ink-jet method

Lesyuk, Rostyslav; Jillek, W.; Bobitski, Yaroslav; Kotlyarchuk, B.

doi:10.1016/j.mee.2010.11.037

Cited by 21 publications

(12 citation statements)

References 12 publications

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“…the obtained width of the sintered track aer on passage. 147,166,168,170,176 The acceleration of large area laser sintering processes was introduced by Yeo et al who used a Nd:YAG laser in combination with a galvano mirror scanner in order to rapidly scan the printed structure. The workow of high resolution patterning via laser irradiation is depicted in Fig.…”

Section: Laser Sinteringmentioning

confidence: 99%

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

Wünscher¹,

Abbel²,

Perelaer³

et al. 2014

J. Mater. Chem. C

250

222

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Well-defined high resolution structures with excellent electrical conductivities are key components of almost every electronic device. Producing these by printing metal based conductive inks on polymer foils represents an important step forward towards the manufacturing of plastic electronic products on an industrial scale. The development of fast, efficient and inexpensive post-deposition sintering technologies for these materials is an important processing step to make this approach commercially viable. This review discusses the advances in alternative sintering approaches for conductive, metal containing inks, which can be processed by inkjet-printing processes. Each sintering approach is examined regarding its mechanism, its compatibility with commonly used materials in the field of flexible electronics, its compatibility with high-throughput manufacturing processes and its applicability to the production of flexible electronic devices.

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Section: Laser Sinteringmentioning

confidence: 99%

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

Wünscher¹,

Abbel²,

Perelaer³

et al. 2014

J. Mater. Chem. C

250

222

View full text Add to dashboard Cite

show abstract

“…[410,412] In particular, inkjet-printed Ag electrodes typically have a contact resistance of 1.8 MΩ cm in comparison to 0.55 MΩ cm for evaporated Ag electrodes in the bottom-contact geometry. [269,413] An example of Ag 3D interconnects for the operation of an LED is shown in Figure 9D. [269,413] An example of Ag 3D interconnects for the operation of an LED is shown in Figure 9D.…”

Section: Electrically Conductive Nanomaterials Inksmentioning

confidence: 99%

Assembly and Electronic Applications of Colloidal Nanomaterials

2016

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Artificial solids and thin films assembled from colloidal nanomaterials give rise to versatile properties that can be exploited in a range of technologies. In particular, solution-based processes allow for the large-scale and low-cost production of nanoelectronics on rigid or mechanically flexible substrates. To achieve this goal, several processing steps require careful consideration, including nanomaterial synthesis or exfoliation, purification, separation, assembly, hybrid integration, and device testing. Using a ubiquitous electronic device - the field-effect transistor - as a platform, colloidal nanomaterials in three electronic material categories are reviewed systematically: semiconductors, conductors, and dielectrics. The resulting comparative analysis reveals promising opportunities and remaining challenges for colloidal nanomaterials in electronic applications, thereby providing a roadmap for future research and development.

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“…The low cost ink-jet printing 4,6,7 with nanoparticle (NP) inclusions could be state a real alternative for the above mention approaches. Various metallic particles, such as silver, copper, gold, and platinum, were used and the processes of their laser-sintering were studied [6][7][8] . The low temperature capability of many polymer based RP materials and deterioration of electrophysical properties in semiconductors under high temperatures can also decide in favor of the ink-jet deposition.…”

Section: Introductionmentioning

confidence: 99%

Low-dose laser sintering of Cu nanoparticles on the ceramic substrate during ink-jet interconnection

2013

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The deposition of nano-size copper particles was carried out by means of ink-jet printing on the ceramic substrate (silicon and faience) using Nd +3 :YAG laser. Glycerin and aqueous based nano copper inks were prepared and were inkjetted in this study. The sintered copper film had a grainy structure with neck-like junctions. The microstructure and soldering properties were examined using XRD, SEM-EDX and optical microscopy. The dependence of the electrical resistance of the ink-jetted copper interconnection lines on the parameters of laser sintering regimes was estimated.

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Low-energy pulsed laser treatment of silver nanoparticles for interconnects fabrication by ink-jet method

Cited by 21 publications

References 12 publications

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

Assembly and Electronic Applications of Colloidal Nanomaterials

Low-dose laser sintering of Cu nanoparticles on the ceramic substrate during ink-jet interconnection

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