Low-Footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-Based Microdisk Lasers and Microdetectors

Campenhout, Joris Van; Binetti, Pra Pietro; Romeo, Pédro Rojo; Régrény, Philippe; Seassal, Christian; Leijtens, X.J.M.; Vries, T. de; Oei, YS Yok-Siang; Veldhoven, René P. J. van; Nötzel, R.; Cioccio, L. Di; Fédéli, Jean-Marc; Smit, M.K.; Thourhout, Dries Van; Baets, Roel

doi:10.1109/lpt.2009.2014391

Cited by 41 publications

(24 citation statements)

References 8 publications

(12 reference statements)

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“…The initial demonstrations of microdisk lasers occurred in the early 1990's 9 . Improved fabrication techniques led to CW electrical pumping in the late 1990's, and in the late 2000's the first experimental applications in on chip communications were shown 55 . Again, due to the small V a and long photon lifetimes, reasonably small threshold currents (< 100 A) have been achieved 53 .…”

Section: Small Laser Types and Their Characteristicsmentioning

confidence: 99%

Advances in small lasers

2014

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In recent years there have been significant advances in the size and characteristics of small lasers, i.e. lasers with dimensions or modes sizes close to or smaller than the wavelength of emitted light. This work has primarily been led by innovative use of new materials and cavity designs. This article reviews some of the latest developments, particularly in metallic and plasmonic lasers, improvements in small dielectric lasers, and the emerging area of small bio-compatible/bioderived lasers. We examine the different approaches employed in small lasers to reduce size and how they lead to significant differences , particularly between metal and dielectric cavity lasers. We present potential applications for the various forms of small lasers and indicate where further developments are required.

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Section: Small Laser Types and Their Characteristicsmentioning

confidence: 99%

Advances in small lasers

2014

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“…However, these modulators have generally high insertion loss. When using III-V material, typically separate dies for the lasers and detectors need to be bonded to have both efficient lasers and detectors [7], [8].…”

Section: Introductionmentioning

confidence: 99%

Realization of a Compact Optical Interconnect on Silicon by Heterogeneous Integration of III–V

Spuesens

Bauwelinck

Régrény

et al. 2013

IEEE Photon. Technol. Lett.

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Abstract-We present a compact optical interconnect on a silicon-on-insulator platform consisting of a directly modulated microdisk laser and detector connected via a silicon waveguide. A single III-V epitaxial structure that contains layers for both the laser and detector ensures that dense integration becomes possible. All fabrication steps for the laser and detector, except for the detector mesa, are carried out simultaneously. The microdisk laser has a threshold current of 0.45 mA and a slope efficiency of 57 µW/mA. The responsivity of the detectors is 0.69 A/W. The full optical link has a static efficiency of 3% and a bandwidth of 7.6 GHz. A large signal modulation was applied and a 10 Gb/s bit pattern could be resolved.Index Terms-Heterogeneous integration, microdisk laser (MDL), optical interconnect, photonic integration, silicon photonics, waveguide photodetector.

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“…Reported total lengths are in the order of 150 µm per coupler, which contributes significantly to the total circuit size. IMEC, COBRA-TU/e and LETI were the first to report a full optical link on a silicon wafer [4]. The link consisted of a laser fabricated by IMEC and a detector fabricated by COBRA, which were connected via a waveguide fabricated in a silicon membrane by LETI.…”

Section: Take Down Policymentioning

confidence: 99%

InP membrane on silicon integration technology

Smit

2013

2013 IEEE Photonics Conference

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Low-Footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-Based Microdisk Lasers and Microdetectors

Cited by 41 publications

References 8 publications

Advances in small lasers

Advances in small lasers

Realization of a Compact Optical Interconnect on Silicon by Heterogeneous Integration of III–V

InP membrane on silicon integration technology

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