Low-noise, high-speed data transmission using a ringing-canceling output buffer

Sekiguchi, Toshio; Horiguchi, Masashi; Sakata, T.; Nakagome, Y.; Ueda, Shinjiro; Aoki, Masakazu

doi:10.1109/4.482208

Cited by 16 publications

(5 citation statements)

References 8 publications

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“…It is done simply by using two pairs of output transistors in parallel and delaying the switching of one pair in respect of the other [56] [57], or by precharging the output at an intermediate level, in a first phase of the switching, and after so me time the output switching is completed [58] [59]. In [60] the same technique is used but with the aim of reducing the ringing in the receiver, taking into account the distortion introduced by the transmission line that connects the output driver with the receivers in other ICs. All these techniques, like those which control the slope of the output switchings, involve the disadvantage of increasing switching time in respect of a conventional output driver.…”

Section: Low Noise Output Driver Design Techniquesmentioning

confidence: 99%

Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs

Aragones¹,

González²,

Rubio³

1999

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Springer-Science+Business Media, B.V.A c.I.P. Catalogue record for this book is available from the Library of Congress. 1.1. Trends in microelectronics technology 1.2. Types oj parasitic coupling in mixed-signal circuits 2 Substrate noise characteristics and propagation This clzapter contains an exhaustive artempt to reveal the elementa/)' characteristics of substrate coupling. The aim of this part is to determine how coupling is affected by factors such as the type of wafer, (he type of coupled devices, the biasing of these devices, and layout and technology parameters.The chapter starts with a description of the mechanisl1ls by which circuit nodes interact wilh the substrate. Next, the way deviee characteristics -layout and technology parameters, device type and biasing-affect eoupling is studied with device simulations and experimental lIleasurements. Lastly, we analyze the way noise propagation is affected by the substrate tJpe or partieular biasing, assuming ideal groUllding conditions. In following chapters the consequences of /loll-ideal supplies Oll the results obtained will be analyzed.

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Section: Low Noise Output Driver Design Techniquesmentioning

confidence: 99%

Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs

Aragones¹,

González²,

Rubio³

1999

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“…In order to preserve signal quality, I/O circuits have been designed to reduce the effects of IC package parasitics that induce IC noise (refer to [3] - [7]). For example, differential techniques provide a noise cancellation advantage, but their implementations are expensive in .terms of pin counts.…”

Section: High-speed I/o Circuitsmentioning

confidence: 99%

“…To achieve constant slew rate, the effective channel width of the output buffer is digitally controlled by an internal PVTcompensation circuit. In effect, the output current is adjusted based on the PVT codes (labeled as p_codes and n_codes in Figure 2 In a fifth circuit (presented in [7]), an output buffer with ringing-cancellation is proposed. This circuit transmits a superimposed two-step pulse that almost completely cancels the ringing in the receiver end.…”

Section: High-speed I/o Circuitsmentioning

confidence: 99%

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High-performance Input/Output Circuit for CMOS Integrated Circuit Interface

Lim¹

2000

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Interface.In recent years, strong demand for high-performance electronic products has fueled the need for high-speed and high-integration VLSI circuits. This demand is expected to continue growing in the future, which will lead to development of IC's that are much more compact and operate at higher frequencies. As a result.preserving signal integrity for proper IC communications becomes an increasingly difficult challenge.In this thesis, an understanding of IC noise in relation to IC packaging is sought. An IC package is modeled with sophisticated 3-D simulators to extract its corresponding parasitics. These parasitics. expressed in terms of resistance.inductance. and capacitance (RLC), are lumped into their RLC circuit equivalent.

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“…For suppressing the waveform ringing, applications employing filter circuits [11] and ferrite [12] [13] are usually suggested. However, these dampen not only the ringing but also the basic waveform depending on the position and number installed, with a further disadvantage of increased communication delays caused by waveform rounding.…”

Section: Introductionmentioning

confidence: 99%

Novel ringing suppression circuit to increase the number of connectable ECUs in a linear passive star CAN

Mori

Suzuki

Maeda

et al. 2012

International Symposium on Electromagnetic Compatibility - EMC EUROPE

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As the number of ECUs in an automobile steadily increases, the demand for ever more ECUs connected to the Controller Area Network (CAN) also rises significantly. However, the number of connectable ECUs in a linear passive star CAN is restricted because of the ringing phenomenon in communication signals. In this paper, we propose a ringing suppression circuit activated on high level ringing voltages. As a result, we can expand the number of connectable ECUs in a linear passive star, which enables construction of low-cost communication networks by reducing the number of gateways required

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Low-noise, high-speed data transmission using a ringing-canceling output buffer

Cited by 16 publications

References 8 publications

Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs

Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs

High-performance Input/Output Circuit for CMOS Integrated Circuit Interface

Novel ringing suppression circuit to increase the number of connectable ECUs in a linear passive star CAN

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