Low-polydispersity novolak resins for i-line resists

Wanat, Stan F.; Rahman, M. Dalil; Durham, Dana L.; McKenzie, Douglas; Cook, Michelle M.

doi:10.1117/12.350169

SPIE Proceedings

1999

DOI: 10.1117/12.350169

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Low-polydispersity novolak resins for i-line resists

Stan F. Wanat

M. Dalil Rahman

Dana L. Durham

et al.

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Characterization of fractionated phenolic resins used in photoresists

Wanat¹,

Rahman²

2003

Polymer Engineering & Sci

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Novolak resins fractionated using a liquid/liquid centrifugal fractionation/separation technique were characterized and contrasted to resins fractionated by conventional methods. The new fractionation method resulted in higher yields of resins with comparable or improved functional properties when used in i‐line sensitive (365 nm) photoresist formulations. By characterizing the isolateld resin and the lower molecular weight (Mw) fractions removed during fractionation, a better understanding of the structural differences associated with the fractionation processes could be determined. The potential for improving the fractionation/separation process and for obtaining higher yields and more consistent resists with the resins was identified.

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Characterization of fractionated phenolic resins used in photoresists

Wanat¹,

Rahman²

2003

Polymer Engineering & Sci

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Novel strategies for novolak resin fractionation: Consequences for advanced photoresist applications

Narasimhan

Wanat

Rahman

2000

Polymer Engineering & Sci

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The importance of well‐characterized novolak resins in the manufacture of high performance photoresists is paramount. Two novel fractionation methods for novolaks synthesized by solution condensation are reported in this paper. Solid resin solutions in methanol and ethyl lactate were fractionated by ultracentrifugation and liquid‐liquid centrifugation (using water and hexane as non‐solvents). The techniques resulted in high yield, low‐polydispersity (high Mw) resins that exhibited superior dissolution rates and lithographic performance when compared to resins obtained by conventional isolation techniques. The effects of solvent/non‐solvent ratio, temperature, and centrifuge rpm on resist performance were evaluated. It was found that at sufficiently high rpm and at 25°C, the Mw and the polydispersity of the fractionated resin increases and the dissolution rate decreases as the solvent/non‐solvent ratio decreases, Slow dissolution rates and improved lithographic performance characteristics in experimental i‐line formulations were obtained for resin solutions fractionated by liquid‐liquid centrifugation using a 1/2 ratio of ethyl lactate (and/or methanol) to hexane. Scaling laws between dissolution rate and polymer molecular weight were derived and the data seem to support reptation‐type diffusion. The use of appropriate process manipulation in order to precisely control resin properties and to design novel resins is discussed.

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Novolak resins and the microelectronic revolution

Wanat

2008

J. Micro/Nanolith. MEMS MOEMS

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Low-polydispersity novolak resins for i-line resists

Cited by 3 publications

References 0 publications

Characterization of fractionated phenolic resins used in photoresists

Characterization of fractionated phenolic resins used in photoresists

Novel strategies for novolak resin fractionation: Consequences for advanced photoresist applications

Novolak resins and the microelectronic revolution

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