Proceedings of 1994 IEEE International Conference on Neural Networks (ICNN'94)
DOI: 10.1109/icnn.1994.374451
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Low power analog neurosynapse chips for a 3-D "sugarcube" neuroprocessor

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Cited by 11 publications
(2 citation statements)
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“…One of the common beyond Moore's law era technologies to improve performance in communication that is being utilized across a variety of computing platforms (including traditional von Neumann computer systems) is three-dimensional (3D) integration. 3D integration has been utilized in neuromorphic systems even from the early days of neuromorphic, especially for pattern recognition and object recognition tasks [2383], [2384]. In more recent applications, 3D integration has been used in a similar way as it would be for von Neumann architectures, where memory is stacked with processing [1058].…”
Section: A Communicationmentioning
confidence: 99%
“…One of the common beyond Moore's law era technologies to improve performance in communication that is being utilized across a variety of computing platforms (including traditional von Neumann computer systems) is three-dimensional (3D) integration. 3D integration has been utilized in neuromorphic systems even from the early days of neuromorphic, especially for pattern recognition and object recognition tasks [2383], [2384]. In more recent applications, 3D integration has been used in a similar way as it would be for von Neumann architectures, where memory is stacked with processing [1058].…”
Section: A Communicationmentioning
confidence: 99%
“…Different methods such as wafer-scale integration, 131,173 multi-chip modules 99,179,185 and die stacking 56,164 have been proposed. The die stacking approach for instance, uses several neural networks integrated circuit planes stacked vertically in a unique circuit.…”
Section: Architecturementioning
confidence: 99%