Low temperature co-fired ceramic on metal (LTCC-M) packaging technology

Fathy, Aly E.; McGinty, F.; Pendrick, V.; Ayers, G. H.; Geller, B.D.; Narayan, Yogendra; Thaler, B.; Chen, H.D.; Liberatore, M.J.

doi:10.1109/epep.2000.895541

Cited by 6 publications

(7 citation statements)

References 1 publication

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“…T he concept of constrained sintering (also called “zero‐shrinkage” technology) has gained increasing attention, particularly in the low‐temperature co‐fired ceramic (LTCC) industry, for the precise control and maintenance of sintering shrinkage and tight dimensional tolerances 1–6 . During co‐firing, stresses develop, because of mismatch in sintering behavior of different components 7–10 .…”

Section: Introductionmentioning

confidence: 99%

Constrained Sintering of Low‐Temperature Co‐Fired Ceramics

Mohanram

Lee

Messing

et al. 2006

Journal of the American Ceramic Society

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This paper discusses the effect of uniaxial compressive stress and pressureless constraint on the microstructure, density, and shrinkage anisotropy during the sintering of two commercial low-temperature co-fired ceramic (LTCC) systems, i.e., Heraeus CT2000 (CT) and DuPont 951Tape (DU). Under uniaxial compression, the ratio of axial to transverse shrinkage of DU is significantly higher than that of CT. A simple linear viscous theory was used to estimate the change in the strain rates produced by the external stress and the stress required to produce zero shrinkage. The theory was found to overestimate the measured stress-induced strain rates. The uniaxial compressive stress required for zero overall shrinkage was estimated to be B60 kPa for DU and 80 kPa for CT. The estimate for the DU materials was in good agreement with the experimental data, but there was significant deviation for the CT material. Higher viscosity and higher constraining stresses led to lower densities in pressure-less constrained CT specimens compared with DU. 1923J ournal

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Section: Introductionmentioning

confidence: 99%

Constrained Sintering of Low‐Temperature Co‐Fired Ceramics

Mohanram

Lee

Messing

et al. 2006

Journal of the American Ceramic Society

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“…For a single turn structure, the inductance per unit length (8) can be expressed in the form of total flux divided by current which generated the flux 0 L I ϕ = (8) Substitute (5) and (7) into (8), yielding inductance per unit length of a single turn planar inductor (9) 0 ln 1 2…”

Section: Model For Inductance Calculationmentioning

confidence: 99%

“…For advantages of applying LTCC technology to high frequency DC/DC converters described above, in recent years, researchers have begun to focus on design and fabrication of planar inductors for low power DC/DC converters based on this technology [8][9][10][11][12][13]. However, no detailed analysis is executed on relationship of conductor arrangements and inductor performance.…”

Section: Introductionmentioning

confidence: 99%

Design of multi-turn LTCC inductors for high frequency DC/DC converters

Wang

Pei

Yang

et al. 2010

2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)

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This paper focuses on designing of multi-turn spiral inductors with multilayer parallel-connected conductors for high frequency DC/DC converters based on low temperature cofired ceramic (LTCC) technology. Effects of conductors' arrangements on performance of LTCC inductors are analyzed. Based on observation and analysis, a model to approximate inductance of LTCC inductors is derived. Simulation results are provided to verify accuracy of the model. At last, a prototype is fabricated and tested in a 8MHz switching-mode buck converter. I.978-1-4244-4783-1/10/$25.00 ©2010 IEEE

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“…Heat dissipation thus become a big challenge and some other measures should be taken to dissipate the heat generated by loss. LTCC-M [8] is a promising technique for improving thermal conductivity and added strength; it offers the ability to co-fire multilayer of lead free tapes onto a ceramic or metal substrate using low cost parallel processing. Based on this technique, switching devices can be mounted directly onto the high thermal conductivity ceramic or metal substrates and connected though wire bonding as shown in Fig.…”

Section: Thermal Improvementmentioning

confidence: 99%

Three-dimensional integration of high frequency DC/DC converters based on LTCC technology

Wang

Pei

Yang

et al. 2009

2009 IEEE 6th International Power Electronics and Motion Control Conference

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This paper explores some strategies of incorporating advantages of low temperature co-fired ceramic (LTCC) technology into design and fabrication of low power high frequency DC/DC converters. High power density and high efficiency are two key factors for power modules. The development of new generation power switches with much less turn-on and turn-off time interval provides new chances for increasing switching frequency and reducing volume of passives, this makes LTCC technology which is commonly used in RF circuit applicable for fabrication and integration of high frequency DC/DC converters. Conductor paste, ceramic tapes, ferrite tapes, capacitor tapes as well as metal substrates are co-fired together to realize three-dimensional inter-connection, passive integration, thermal performance improvement and structure optimization.I.

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Low temperature co-fired ceramic on metal (LTCC-M) packaging technology

Cited by 6 publications

References 1 publication

Constrained Sintering of Low‐Temperature Co‐Fired Ceramics

Constrained Sintering of Low‐Temperature Co‐Fired Ceramics

Design of multi-turn LTCC inductors for high frequency DC/DC converters

Three-dimensional integration of high frequency DC/DC converters based on LTCC technology

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