Low-temperature creep in pure metals and alloys

Abstract

Many crystalline materials are known to exhibit creep at low temperatures (T \ 0.3T m ). Here, we review and analyze the phenomenological relationships that describe primary creep. The discussion focuses on the controversy as to whether power-law or logarithmic descriptions better describe the experimental database. We compile data from the literature as well as new copper data recently taken by the authors. Depending on the material, it appears that the logarithmic form can somewhat better describe creep behavior at low temperatures, while the power-law behavior manifests at intermediate temperatures. The basic mechanism(s) of low-temperature creep plasticity is examined, as well.

An Interdisciplinary Approach for Investigating an Accident Originating from Leakage in a Gasketed Bolted Joint

“…There are few works (e.g., Kassner and Smith (2014); Kassner et al (2015); Deibler (2014); Reed and Walsh ( 2017)) that model creep over a long time (i.e., dozens of years) of AISI 304/316 steel components operated in ground benign environments (i.e., room temperature, no significant vibrations, etc.). These propose the following two models:…”

Effect of Surface Mechanical Treatments on the Microstructure-Property-Performance of Engineering Alloys

“…The surface interacts with the surrounding environment and loads. Hence, it is more likely to deteriorate over time, for example, fretting, fatigue, corrosion, wear, and creep [126]. The surface characteristics of engineering materials have a significant effect on the serviceability and component life.…”

Identifying the microstructural features associated with void nucleation during elevated‐temperature deformation of copper

“…We examine the microstructural features associated with void formation during elevated‐temperature (300°C) deformation of oxygen‐free high‐conductivity (OFHC) Cu. This is approximately 0.42 T H (homologous temperature) for copper, and time‐dependent plasticity (creep) is expected at this temperature 50 . This material was chosen to examine the relationship between cavitation and the evolving microstructure without the confounding effects of impurity segregation.…”

“…This is approximately 0.42 T H (homologous temperature) for copper, and time-dependent plasticity (creep) is expected at this temperature. 50 This material was chosen to examine the relationship between cavitation and the evolving microstructure without the confounding effects of impurity segregation. The microstructural features associated with incipient voids, including slip bands, geometrically necessary dislocations (GNDs), twins, and grain-boundary triple junctions were characterized in situ using EBSD.…”