Paraelectric, pyrochlore thin films of Bi1.5Zn1.0Nb1.5O7 were fabricated on platinized silicon and Ni‐plated Cu foil by aerosol deposition at room temperature for embedded capacitor applications. The highly dense films thus obtained showed superior dielectric properties without any heat treatment. The dielectric constant and dielectric loss of tan δ of the films at 100 kHz were over 160 and less 0.05, respectively. Furthermore, the films showed markedly superior capacitance density (>100 nF/cm2) and low leakage current density (10−4–10−7 A/cm2 at 3.0 V). The results demonstrated the promising potential for embedded passive components in printed circuit board applications.