Applied Surface Science
 2023
DOI: 10.1016/j.apsusc.2023.157854
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Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification

Min-Hsun Yu
1
,
Jia-Juen Ong
2
,
Dinh-Phuc Tran
3
et al.
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Cited by 12 publications
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