1971
DOI: 10.1007/bf02403083
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Low-temperature deformation behaviour of polycrystalline copper

Abstract: Low-temperature plastic flow in copper was investigated by studying its tensile and creep deformation characteristics. The dependence of the flow stress on temperature and strain rate was used to evaluate the thermal activation energy while the activation area was derived from the change-in-stress creep experiments. A value of 0.6 eV was obtained for the total obstacle energy both in electrolytic and commerical copper. The activation areas in copper of three selected purities fell in the range 1200 to 100 b ~.… Show more

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Cited by 13 publications
(3 citation statements)
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“…If other metals, such as aluminum, are examined, unrealistic stresses and/or strains are predicted for Eq. (25). In Aluminum, cross-slip may be an important thermally activated mechanism for plasticity.…”
Section: Discussion Of the Mechanisms Of Low-temperature Creep Logarimentioning
confidence: 98%
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“…If other metals, such as aluminum, are examined, unrealistic stresses and/or strains are predicted for Eq. (25). In Aluminum, cross-slip may be an important thermally activated mechanism for plasticity.…”
Section: Discussion Of the Mechanisms Of Low-temperature Creep Logarimentioning
confidence: 98%
“…However, while complicated, there is an analytic solution. First, while one cannot integrate (25) to get c t ð Þ, one can easily obtain the inverse solution for t c ð Þ: where Ei is the exponential integral…”
Section: Discussion Of the Mechanisms Of Low-temperature Creep Logarimentioning
confidence: 99%
See 1 more Smart Citation