Low-temperature die attach material

Abstract

JNTRO DUCTI0 NSilver-Glass (AuSublM) die attach materials have been in use for more that ten years as a substitute for gold eutectic. The standard application of die attach materials is for bonding silicon die to alumina and metallized alumina cavities. Conventional silver-glass materials are based on lead borate glass and silver flakes as inorganic constituents. The silver flakes and lead borate glass are mixed with the organic component to form a thermoplastic suspension. The well defined suspension is then applied to the cavity of the package by using high speed automatic dispensing equipment. A silicon or metallized silicon die is picked and placed onto the adhesive. The assembled package is then