In this paper we report a set of statistical static timing (SSTA) studies performed on a UMC test chip manufactured at 90nm process node. We employed comprehensive variation extraction techniques to prepare a complete set of input variation data for the technology node. Our studies include SSTA runs in the presence of various process variation components, comparison of SSTA results to those obtained from traditional corner flows, and statistical optimization to improve parametric yield of the design. We observed that generally traditional corner methodologies produce more pessimistic results than those obtained from the SSTA. We also noticed that it is hard to guarantee pessimism in the traditional analyses, unless all the process corner combinations are sampled.

A lid or heat spreader is used for packaging microprocessor chips. There are two primary functions for the lid: dissipate heat efficiently from the microprocessor and provide physical protection to the fragile silicon chip.

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JNTRO DUCTI0 NSilver-Glass (AuSublM) die attach materials have been in use for more that ten years as a substitute for gold eutectic. The standard application of die attach materials is for bonding silicon die to alumina and metallized alumina cavities. Conventional silver-glass materials are based on lead borate glass and silver flakes as inorganic constituents. The silver flakes and lead borate glass are mixed with the organic component to form a thermoplastic suspension. The well defined suspension is then applied to the cavity of the package by using high speed automatic dispensing equipment. A silicon or metallized silicon die is picked and placed onto the adhesive. The assembled package is then