Low temperature epoxy bonding for wafer level MEMS packaging

Kim, Yong Kook; Kim, Min Jung; Kim, Soo Won; Ju, Byeong Kwon

doi:10.1016/j.sna.2007.10.048

Cited by 51 publications

(20 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…And among interfacial bonding techniques, anodic bonding involving high temperature [lowest reported temperature is 250°C in (Chen et al 2007)] should be avoided. Among intermediate melting materials, polymers are potentially suitable (Jourdain et al 2005;Kim et al 2008; ZineEl-Abidine and Okoniewski 2009). Adhesive bonding relies on viscous polymers that are deposited onto the surface of one of the wafers and that fit the space in between the lid wafer and the substrate wafer.…”

Section: Introductionmentioning

confidence: 99%

Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy

et al. 2012

View full text Add to dashboard Cite

International audienceIn this paper a wafer-level process is proposed to fully integrate carbon-based micro-supercapacitor onto silicon substrate. This process relies on the deposition of a paste containing carbon, PVDF and acetone into cavities etched in silicon. After electrolyte deposition in a controlled atmosphere, a wafer-level encapsulation is realized. Cyclic voltammetry performed on non-encapsulated microcomponents showed specific energy of 257 mJ cm-2 for 336 lm deep cavities. The specific encapsulation process developed was tested separately and proved to be efficient in terms of resistance to organic electrolytes and mechanical strength

show abstract

Section: Introductionmentioning

confidence: 99%

Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy

et al. 2012

View full text Add to dashboard Cite

show abstract

“…Localized heating bonding using polysilicon has also been used and has the advantage of controlling the temperature at the bond site [11]. Epoxy bonding [12, 13] has been used but has limited use since it is not hermetically sealed, which is often desired in most MEMS devices. Other low-temperature bonding techniques include the use of polymers like SU-8 [14], benzo-cyclobutene BCB [15], poly-dimethyl siloxane (PDMS) [16] and parylene-C [17–19].…”

Section: Introductionmentioning

confidence: 99%

Flexible Chip-Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

Jackson

Muthuswamy

2009

J. Microelectromech. Syst.

View full text Add to dashboard Cite

We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15-20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices.

show abstract

“…With this approach there is no need of external impulsion so the connections and the system complexity is reduced, providing a portable reservoir of pneumatic energy that can be integrated in a small area of the chip. However, MEMS packaging and encapsulation results more expensive compared to the microsystem itself when considering pressure sealing [5], being necessary to develop simple and low cost sealing methods fully compatible and easy to integrate with former microsystem fabrication processes and materials.…”

Section: Introductionmentioning

confidence: 99%

Fabrication process of a SU-8 monolithic pressurized microchamber for pressure driven microfluidic applications

Perdigones

Quero

2011

Proceedings of the 8th Spanish Conference on Electron Devices, CDE'2011

View full text Add to dashboard Cite

This paper describes a simple and low cost fabrication process to develop monolithic SU-8 pressurized microchambers for pressure driven microfluidic applications. The device consists in a SU-8 hermetic and monolithic structure fabricated over a FR4 substrate which can store pressurized air for several days. With the proposed design and process, the contained pressure can be easily adjusted according to the corresponding fluid impulsion requirements. The structure has been intended to be easily integrated with a microvalve or a micropump that can manage the stored pressure to drive fluids in microfluidic platforms or LOCs, improving the autonomy and portability and avoiding the use of external macroscale pumps.

show abstract

Low temperature epoxy bonding for wafer level MEMS packaging

Cited by 51 publications

References 13 publications

Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy

Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy

Flexible Chip-Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

Fabrication process of a SU-8 monolithic pressurized microchamber for pressure driven microfluidic applications

Contact Info

Product

Resources

About