1991
DOI: 10.1016/0040-6090(91)90335-u
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Low temperature growth of highly oriented TiN films by ion-assisted deposition

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Cited by 17 publications
(3 citation statements)
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“…Although a lot of work has been published focusing on the influence of ion energy in physical vapor deposition (PVD) or ion-assisted processes for metal based coatings [28,29,[37][38][39][40][41][42], yet, only little work has been published correlating the average ion energy and the atomic oxygen flux with the properties of barrier coatings for polymers in PECVD processes. Starostin et al [11] and Elam et al [36] estimated the energy spent per precursor molecule in a plasma assisted atmospheric pressure process for the deposition of silicon oxide barrier coatings and reported an increase of barrier performance for an increased energy spent per precursor molecule.…”
Section: Influence Of Average Ion Energy and Atomic Oxygen Flux Per S...mentioning
confidence: 99%
“…Although a lot of work has been published focusing on the influence of ion energy in physical vapor deposition (PVD) or ion-assisted processes for metal based coatings [28,29,[37][38][39][40][41][42], yet, only little work has been published correlating the average ion energy and the atomic oxygen flux with the properties of barrier coatings for polymers in PECVD processes. Starostin et al [11] and Elam et al [36] estimated the energy spent per precursor molecule in a plasma assisted atmospheric pressure process for the deposition of silicon oxide barrier coatings and reported an increase of barrier performance for an increased energy spent per precursor molecule.…”
Section: Influence Of Average Ion Energy and Atomic Oxygen Flux Per S...mentioning
confidence: 99%
“…1 Films grown with no external substrate heating are columnar and underdense, as demonstrated by open inter-and intra-columnar voids visible in cross-sectional transmission electron microscopy images and by X-ray reflectivity results. [2][3][4][5] Thus, these layers exhibit low nanoindentation hardness and elastic modulus values. Applying ion bombardment during film growth is often used to enhance densification by providing continuous near-surface ion mixing and enhancing adatom mean-free paths.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4][5] A feature of this arc discharge is that titanium as well as nitrogen gas have a high degree of ionization due to charge transfer from Ti ϩ to nitrogen gas, and emissions from both Ti ϩ and N 2 ϩ are very intense. [1][2][3][4][5] A feature of this arc discharge is that titanium as well as nitrogen gas have a high degree of ionization due to charge transfer from Ti ϩ to nitrogen gas, and emissions from both Ti ϩ and N 2 ϩ are very intense.…”
Section: Introductionmentioning
confidence: 99%